GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC services, offering spec-in and SoC (System-on-Chip) integration, physical implementation, advanced packaging technologies, turnkey manufacturing, as well as cutting-edge solutions such as HBM (High-Bandwidth Memory) and die-to-die interconnect IPs.
As a leader in AI, HPC and networking, GUC delivers innovative solutions driven by technical excellence. Its close partnership with TSMC – which holds a 35% stake and serves as GUC’s exclusive foundry partner – provides access to state-of-the-art process and packaging technologies, including CoWoS, InFO and SoIC.
Headquartered in Hsinchu, Taiwan (TWSE: 3443), GUC operates offices in North America, China, Europe, Korea, Japan and Vietnam, ensuring worldwide support for customer projects.
GUC’s solutions:
Advanced Packaging Technology (APT) Design and Production Service
Interposer design and production service for CoWoS, InFO and SoIC
SI / PI / THM simulation
Substrate and package design
Industry-leading HBM2/2E/3 Controller and PHY IP
Industry-leading die-to-die IP : GLink-2.5D
Industry-leading die-on-die IP : GLink-3D
SoC Integration
ARM / CPU subsystem
IP Customization
Domain IP Integration
SoC Design
Implementation Methodologies
Advanced Technology – 7 / 5 / 3nm
High Gate Count, High Power Design
Extra Large Scale Chip Design
PPA Optimization
Design for Test (DFT)
Design for Manufacturing (DFM)
Integrated Manufacturing
Package Engineering
Test Engineering
Product Engineering
Quality and Reliability Engineering
Supply Chain Management
