EOL & PCN
Your life cycle service
Proactive information
We inform you about EOLs and PCNs from the manufacturers we represent before things become critical.
Last Time Buy handling
Demand assessment and handling of the final ordering window, so that nothing is lost.
Alternatives & supply agreements
Suggested alternatives and long-term supply agreements safeguard your series production.
Product discontinuations (End of Life) and product changes (Product Change Notifications) are part of everyday life in the semiconductor industry — what matters is finding out in time. INELTEK proactively informs its customers about EOLs and PCNs from the manufacturers it represents and supports them with Last Time Buy handling, suggested alternatives and long-term supply agreements, so that your series production stays supplied.
EOL and PCN database
You will find the searchable database of all discontinuations and change notifications right below on this page — filterable by type and manufacturer, with links to the original documents.
Do you have a question about a specific discontinuation or need a document? Contact us — we will provide you with the documents directly.
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EOL & PCN database
Part number: SYST- 03QQZX502
Data Sheet – ZL40268 – Low Skew, Low Additive Jitter 8 Output HCSL/LVDS/LVPECL Fanout Buffer with Per Enable Control
Microchip
Part number: SYST- 03YDHP471
Data Sheet – RN4870/71 Bluetooth Low Energy Module Data Sheet
Microchip
Part number: SIM800H series/SIM5320 series/SIM800(S2- 105MB)
End of Life(EoL) Notification SIM800H
SIMCom
Part number: KSRA- 25JAKY062
CCB 4495 Initial Notice: Qualification of MTAI as a new assembly site for selected MCP25625 device family available in 28L QFN (6.0X6.0X0.9mm) package.
Microchip
Part number: MDG/21/12577
New and additional Test & Finishing line for ST25R3916 and ST25R3917
STMicroelectronics
Part number: RMES- 02KZIM086
CCB 2695.009 Final Notice: Qualification of ANAC as an additional assembly site for selected KSZ9131RNXxx and KSZ9031RNXxx device families available in 48L VQFN (7x7x0.9 mm) package.
Microchip
Part number: SYST- 01FLSJ138
ERRATA – PIC32MK Motor Control and General Purpose Errata and Data Sheet Clarification
Microchip
Part number: GBNG- 28ZDDO521
CCB 3788.002 Final Notice: Qualification of Lintec backside coating (BSC) material for selected Micrel MIC2782xxx device family available in 6L WLCSP (1.2×0.8×0.63mm) package at UAT assembly site.
Microchip
Part number: SYST- 22OXZE905
ERRATA – PIC18F27/47/57Q83 Silicon Errata and Data Sheet Clarification Silicon Die Revision Addition
Microchip
Part number: SYST- 22ULJY515
ERRATA – PIC18F27/47/57Q84 Silicon Errata and Data Sheet Clarifications Silicon Die Revision Addition
Microchip
Part number: SYST- 28BMIN243
Data Sheet – SST26VF020A 2.5V/3.0V 2-Mbit Serial Quad I/O Flash Memory
Microchip
Part number: KSRA- 08ZYLW084
CCB 4420 Final Notice: Implement new carrier tape width (24mm) for Atmel ATSAM4C32CA-AUR catalog part number (CPN) available in 100L LQFP (14x14x1.4mm) package tested at ASE9 and MPHL final test site.
Microchip
Part number: KSRA- 13AKNI696
CCB 4440 Final Notice: Qualification of MMT as an additional assembly site for selected MTCH112, MTCH810 and PIC12xxxx device families available in 8L DFN (3x3x0.9mm) package.
Microchip
Part number: LIAL- 18GBSB625
eSign # E000038680: End of Life (EOL) of CMFCLGF50X60CTAMF-AS and CMFCLGL100X120CBTAMF-AS catalog part numbers (CPN).
Microchip
Part number: KSRA- 07HVQF409
CCB 4031 Final Notice: Qualification of Microchip Technology Tempe – Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.
Microchip
Part number: PCN- 2021- 001
Introducing TH25Q-16HB-MSCI as an Alternative 16 Mb Flash for ESP8266 Module Series
Espressif
Part number: PCN20025
Migration of Solder Paste for Package Decoupling Capacitors from RoHS to Sn/Pb for PolarFire Military Temperature Devices
Part number: PDN20028
Libero Design Suite Software—Discontinuation of Support for Linux RHEL 6.6 Through RHEL 6.11 and CentOS 6.6 Through CentOS 6.11 Operating Systems
Part number: RMES- 08OEQO165
CCB 4082.007 Final Notice: Qualification of MTAI as a new final test site for selected Microsemi products available in 48L LQFP (7x7x1.4mm) package.
Microchip
