EOL & PCN
Your life cycle service
Proactive information
We inform you about EOLs and PCNs from the manufacturers we represent before things become critical.
Last Time Buy handling
Demand assessment and handling of the final ordering window, so that nothing is lost.
Alternatives & supply agreements
Suggested alternatives and long-term supply agreements safeguard your series production.
Product discontinuations (End of Life) and product changes (Product Change Notifications) are part of everyday life in the semiconductor industry — what matters is finding out in time. INELTEK proactively informs its customers about EOLs and PCNs from the manufacturers it represents and supports them with Last Time Buy handling, suggested alternatives and long-term supply agreements, so that your series production stays supplied.
EOL and PCN database
You will find the searchable database of all discontinuations and change notifications right below on this page — filterable by type and manufacturer, with links to the original documents.
Do you have a question about a specific discontinuation or need a document? Contact us — we will provide you with the documents directly.
Question about a specific discontinuation?
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EOL & PCN database
Part number: SYST- 10FXRO272
Data Sheet – 24AA16H/24LC16BH/24FC16H 16K I2C Serial EERROM with Half-Array Write-Protect Data Sheet
Microchip
Part number: SYST- 10IPXG475
Data Sheet – 24AA01/24LC01B/24FC01 1K I2C Serial EEPROM Data Sheet
Microchip
Part number: SYST- 10MDRO647
Data Sheet – 24AA04/24LC04B/24FC04 4K I2C Serial EEPROM Data Sheet
Microchip
Part number: SYST- 10SIQN022
Data Sheet – 24AA04H/24LC04BH/24FC04H 4K I2C Serial EEPROM with Half-Array Write-Protect
Microchip
Part number: JAON- 04FTWF456
CCB 4540 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.
Microchip
Part number: JAON- 04IGFH099
CCB 4542 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and gold (Au) bond wire material assembled at MMT assembly site.
Microchip
Part number: JAON- 04TMOL584
CCB 4539 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.
Microchip
Part number: KSRA- 04SQKB836
Memo Log # ML0220210001: Implementation of Catalog Part Numbers (CPN) convention changes for selected Microsemi High Reliability Discrete Solutions (HRDS) products including products with cage codes/manufacturer codes 43611/CDWR and SD633/CIRL.
Microchip
Part number: KSRA- 25JAKY062
CCB 4495 Final Notice: Qualification of MTAI as a new assembly site for selected MCP25625 device family available in 28L QFN (6.0X6.0X0.9mm) package.
Microchip
Part number: LIAL- 03QXCU643
CCB 3640.003 Final Notice: Qualification MTAI as a new final test site for AT89C5131A-S3SUL Atmel catalog part number (CPN) available in 52L PLCC (19.1×19.1×4.4mm) package.
Microchip
Part number: JAON- 04DXFD964
CCB 4541 Final Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.
Microchip
Part number: RMES- 22JKYM836
CCB 4270 Final Notice: Qualification of GTK as a new assembly site for selected Atmel products available in 28L SOIC (.300in) package.
Microchip
Part number: GBNG- 06JPSY308
CCB 4204 Final Notice: Qualification of Microchip Technology Tempe – Fab 2 (TMGR) as a new fabrication site for selected Microsemi SG1524BN, SG2524Bxx and SG3524Bxx device families available in 16L PDIP (.300in) and 16L SOIC (.300in) packages.
Microchip
Part number: KSRA- 29BDJE236
CCB 4239 Final Notice: Qualification of NSEB as a new assembly site for HV892K7-G catalog part number (CPN) available in 10L WDFN (4x4x0.8mm) package.
Microchip
Part number: SYST- 04LQCK978
ERRATA – PIC16(L)F18855/18875 Family Silicon Errata and Data Sheet Clarification Document Revision
Microchip
Part number: SYST- 05UNGD328
ERRATA – PIC32CM MC00 Family Data Sheet Clarifications and Silicon Errata
Microchip
Part number: ASER- 25FYQB098
CCB 4397 Final Notice: Qualification of MTAI as a new assembly site for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 8L SOIC (3.90mm) package.
Microchip
Part number: JAON- 27XQGL571
CCB 4470 Final Notice: Implement new carrier tape and reel for selected Atmel products available in 64L TQFP (14x14x1.0mm) package at ASE9 final test site.
Microchip
Part number: 20210125
Notice of Our Supplier’s Improprieties regarding Certification of its Chemical Products, which Integrated into Epson’s Timing Device Products
Epson
Part number: JAON- 18FUUS481
eSign # E000041067: End of Life (EOL) Notice of VSC3340XJJ-01 and VSC3340XJJ-31 Microsemi catalog part numbers (CPN).
Microchip
