EOL & PCN
Your life cycle service
Proactive information
We inform you about EOLs and PCNs from the manufacturers we represent before things become critical.
Last Time Buy handling
Demand assessment and handling of the final ordering window, so that nothing is lost.
Alternatives & supply agreements
Suggested alternatives and long-term supply agreements safeguard your series production.
Product discontinuations (End of Life) and product changes (Product Change Notifications) are part of everyday life in the semiconductor industry — what matters is finding out in time. INELTEK proactively informs its customers about EOLs and PCNs from the manufacturers it represents and supports them with Last Time Buy handling, suggested alternatives and long-term supply agreements, so that your series production stays supplied.
EOL and PCN database
You will find the searchable database of all discontinuations and change notifications right below on this page — filterable by type and manufacturer, with links to the original documents.
Do you have a question about a specific discontinuation or need a document? Contact us — we will provide you with the documents directly.
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EOL & PCN database
Part number: JAON- 14PVXG212
CCB 3737 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected Atmel products available in 48L VQFN package at ASCL assembly site.
Microchip
Part number: JAON- 14SGUP622
CCB 4442.001 Initial Notice: Qualification of G631HQ mold compound material for Atmel AT8USDX6CDR-RUTU and AT8UA1184AE5-RUTU catalog part numbers (CPN) available in 144L LQFP (20x20x1.4mm) package.
Microchip
Part number: KSRA- 05LZRG100
CCB 4121 Final Notice: Qualification of HR-5104 die attach material for Micrel DSA1121WA1-100.0000VAO catalog part number (CPN) available in 6L VDFN (3.2×2.5×0.9mm) package at NSEB assembly site.
Microchip
Part number: KSRA- 09VMYP837
CCB 4154.001 Final Notice: Qualification of MMT as an additional assembly site for SST25VF080B-50-4C-PAE catalog part number (CPN) available in 8L PDIP package.
Microchip
Part number: KSRA- 10VTZM377
CCB 4507 Initial Notice: Qualification of MMT as an additional assembly site for selected products of MCP9844T and MCP98244T device family available in 8L TDFN (2x3x0.8mm ) package.
Microchip
Part number: KSRA- 15DGBH859
CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.
Microchip
Part number: KSRA- 15DGBH859
CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.
Microchip
Part number: KSRA- 15SEZS912
CCB 4245 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA57xx, ATA58xx, ATA82xx and ATA85xx device families available in 32L VQFN (5x5x1mm) package using palladium coated copper with gold flash (CuPdAu) bond wire
Microchip
Part number: KSRA- 16TFZQ917
CCB 4423 Final Notice: Qualification of MPHL as an additional final test site for Atmel ATSAMC21Nxxx and ATSAMC20Nxxx device families available in 100L TQFP (14x14x1mm) package.
Microchip
Part number: LIAL- 09UEWG307
CCB 4395 Initial Notice: Qualification of MMT as an additional assembly site for selected Micrel products available in 16L VQFN (3x3x1.00mm) package.
Microchip
Part number: LIAL- 12WRCV778
CCB 2927.001 and CCB 3280.002 Final Notice: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xC, AT24C128C, AT24C16C, AT24C256C, AT24C32D and AT24C64D device families available in 8L SOIC package.
Microchip
Part number: LIAL- 13ERYV184
CCB 4198.001 Final Notice: Qualification of ASSH as a new assembly site for selected 24xx01, 24xx02, 24xx04, 24xx08 and 24xx16 device families available in 8L TSSOP package.
Microchip
Part number: LIAL- 13ONQB759
Waterfall Miura-B1 Final Notice: Implement silicon die revision B1 and implement additional chip ID for selected ATSAMA5D3xx device families.
Microchip
Part number: LIAL- 14BIKU061
CCB 4510 Final Notice: Implement Microchip Part Aging Policy, Tape and Reel Combination rules, Label and Packing Changes for selected Microsemi High Reliability Discrete Solutions (HRDS) products
Microchip
Part number: LIAL- 14RZLJ133
CCB 4159 Final Notice: Implement Microchip Part Aging Policy, Recertification and Combination rules, Labels and Packing Changes for selected Microsemi Field Programmable Gate Array (FPGA) and Mixed Signal and ASIC(MSA) products
Microchip
Part number: LIAL- 15QPNY176
CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.
Microchip
Part number: LIAL- 15QPNY176
CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.
Microchip
Part number: LIAL- 21DKJL279
CCB 4439.001 and 4439.002 Final Notice: Qualification of MMT as an additional assembly site for selected products available 8L DFN (3x3x0.9mm) and (2x3x0.9mm) packages.
Microchip
Part number: LIAL- 24KOXB344
CCB 4477 Final Notice Implement additional cover tape, carrier tape and plastic reel material supplier for selected Micrel products available in 3L, 5L, 6L and 8L SOT23, 5L and 6L TSOP and 8L SOIC packages at STAR assembly site.
Microchip
Part number: LIAL- 29JCGD899
CCB 4439 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L DFN (4x4x0.9mm) package at MMT assembly site
Microchip
Part number: RMES- 11LXUY101
CCB 4532 Final Notice: Implement Microchip Top marking changes for selected Microsemi Field-Programmable Gate Arrays (FPGAs) products available in various packages.
Microchip
Part number: RMES- 13GXSA956
CCB 4441 Final Notice: Qualification of Elite Semiconductor Microelectronics Technology (ESMT12) as a new fabrication site for Die #2 of a multi-die IS1678xx device family available in 40L VQFN (6x6x0.9mm) package.
Microchip
Part number: RMES- 15KLMX168
CCB 4502 Initial Notice: Qualification of NSEB as a new assembly site for ATTINY43x, ATTINYx4x, ATTINYx313x, ATTINY84x, ATTINY1634x, ATTINY44x, ATTINY13x, ATTINY85x, AT73C508, ATTINY45x, ATTINY25x and QT14C10 device families available in 20L WQFN (4X4X0.8mm) package.
Microchip
Part number: RMES- 15ZREP293
CCB 3379.002 and CCB 3280.001 Final Notice: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xD, AT24C16D and AT24C32E device families available in 8L SOIC packages.
Microchip
Part number: RMES- 19RHZI746
CCB 4318 Final Notice: Qualification of ASCL as an additional assembly site for selected products available in 100L VQFN (12X12X0.9mm) package.
Microchip
