EOL & PCN
Your life cycle service
Proactive information
We inform you about EOLs and PCNs from the manufacturers we represent before things become critical.
Last Time Buy handling
Demand assessment and handling of the final ordering window, so that nothing is lost.
Alternatives & supply agreements
Suggested alternatives and long-term supply agreements safeguard your series production.
Product discontinuations (End of Life) and product changes (Product Change Notifications) are part of everyday life in the semiconductor industry — what matters is finding out in time. INELTEK proactively informs its customers about EOLs and PCNs from the manufacturers it represents and supports them with Last Time Buy handling, suggested alternatives and long-term supply agreements, so that your series production stays supplied.
EOL and PCN database
You will find the searchable database of all discontinuations and change notifications right below on this page — filterable by type and manufacturer, with links to the original documents.
Do you have a question about a specific discontinuation or need a document? Contact us — we will provide you with the documents directly.
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EOL & PCN database
Part number: SYST- 09TYIJ481
ERRATA – ATmega808/809/1608/1609 Silicon Errata and Data Sheet Clarification
Microchip
Part number: SYST- 10QRAR381
ERRATA – ATmega4808/4809 Silicon Errata and Data Sheet Clarification
Microchip
Part number: SYST- 10TSQD600
ERRATA – ATmega3208/3209 Silicon Errata and Data Sheet Clarification
Microchip
Part number: ASER- 25FYQB098
CCB 4397 Final Notice: Qualification of MTAI as a new assembly site for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 8L SOIC (3.90mm) package.
Microchip
Part number: ASER- 25RLDG830
CCB 4279.002 Initial Notice: Qualification of GTK as a new assembly site for selected SST39VF3201xx and SST39VF3202xx device families available in 48L TSOP (12x20mm) package.
Microchip
Part number: ASER- 27LSSS520
CCB 4514 Initial Notice: Qualification of MTAI as an additional assembly site for selected MSCC products available in 48L VQFN (7x7x1mm) package.
Microchip
Part number: JAON- 20DIBE102
CCB 4179 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA663454 and ATA663431 device families available in 16L VDFN (3×5.5x1mm) package.
Microchip
Part number: JAON- 27OWHZ565
CCB 4533 Initial Notice: Qualification of MMT as a new assembly site for selected IS1677SM device family available in 40L VQFN (6x6x0.9mm) package using die #2 fabricated at Elite Semiconductor Microelectronics Technology (ESMT12) fab site.
Microchip
Part number: LIAL- 08IMMO486
CCB 4508 Initial Notice: Qualification of NSEB as a new assembly site for selected ATTINY20, ATTINY40, AT42QT2120, AT42QT1070, AT42QT1050 device families available in 20L VQFN (3x3x0.85mm) package.
Microchip
Part number: LIAL- 08RPHO713
CCB 3459.002 Final Notice: Qualification of MTAI as an additional assembly site for selected Micrel automotive products available in 32L VQFN (5x5x0.9mm) package.
Microchip
Part number: LIAL- 09ERER337
CCB 4527 Initial Notice: Qualification of ASE as an additional assembly site for selected PM40xxx, PM41xxx and PM42xxx Microsemi device families available in 1467L BBGA (40x40x4.03mm) package.
Microchip
Part number: LIAL- 23USLU235
CCB 3979 and 3979.001 Final Notice: Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly site.
Microchip
Part number: RMES- 11LZPK817
CCB 4569 Final Notice: Qualification of MMT as an additional assembly site for ATA6663-FAQWxx device family available in 8L VQFN (3x3x1.0mm) package.
Microchip
Part number: ASER- 05IJPW824
CCB 4556 Initial Notice: Qualification of SIGN as a new assembly site for selected SST39V320xx and SST38VF640xx device families available in 48L TSOP (12x20mm) package.
Microchip
Part number: ASER- 09XMLZ090
CCB 4562 Initial Notice: Qualification of a new bill of materials (BOM) for selected PIC18Fxxx and PIC16Fxxx device families available in 128L LQFP (14x14x1.4mm) package at ANAP assembly site.
Microchip
Part number: ASER- 25FYQB098
CCB 4397 Final Notice: Qualification of MTAI as a new assembly site for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 8L SOIC (3.90mm) package.
Part number: RMES- 09AHZT744
CCB 4347.001 Final Notice: Implement new packing material (JEDEC tray) and packing changes for selected RN41Nxxx module.
Microchip
Part number: SYST- 10ELHW772
Data Sheet – MIC23153 – 4MHz PWM 2A Buck Regulator with HyperLight Load® and Power Good
Microchip
