我们在情况变得紧急之前,就向您通报所代理制造商的 EOL 和 PCN。
需求评估和最后订购窗口的处理,确保万无一失。
替代方案建议和长期供货合同为您的批量生产保驾护航。
产品停产(End of Life)和产品变更(Product Change Notifications)是半导体行业的日常——关键在于及时获知。INELTEK 主动向客户通报所代理制造商的 EOL 和 PCN,并通过最后购买处理、替代方案建议和长期供货合同提供支持,确保您的批量生产供应不断。
包含所有停产和变更通知的可搜索数据库就在本页下方——可按类型和制造商筛选,并链接至原始文件。
您对某项具体停产通知有疑问或需要相关文件?请联系我们——我们将直接为您提供相关资料。
零件编号: SYST- 03QQZX502
Data Sheet – ZL40268 – Low Skew, Low Additive Jitter 8 Output HCSL/LVDS/LVPECL Fanout Buffer with Per Enable Control
Microchip
零件编号: SYST- 03YDHP471
Data Sheet – RN4870/71 Bluetooth Low Energy Module Data Sheet
Microchip
零件编号: SIM800H series/SIM5320 series/SIM800(S2- 105MB)
End of Life(EoL) Notification SIM800H
SIMCom
零件编号: KSRA- 25JAKY062
CCB 4495 Initial Notice: Qualification of MTAI as a new assembly site for selected MCP25625 device family available in 28L QFN (6.0X6.0X0.9mm) package.
Microchip
零件编号: MDG/21/12577
New and additional Test & Finishing line for ST25R3916 and ST25R3917
STMicroelectronics
零件编号: RMES- 02KZIM086
CCB 2695.009 Final Notice: Qualification of ANAC as an additional assembly site for selected KSZ9131RNXxx and KSZ9031RNXxx device families available in 48L VQFN (7x7x0.9 mm) package.
Microchip
零件编号: SYST- 01FLSJ138
ERRATA – PIC32MK Motor Control and General Purpose Errata and Data Sheet Clarification
Microchip
零件编号: GBNG- 28ZDDO521
CCB 3788.002 Final Notice: Qualification of Lintec backside coating (BSC) material for selected Micrel MIC2782xxx device family available in 6L WLCSP (1.2×0.8×0.63mm) package at UAT assembly site.
Microchip
零件编号: SYST- 22OXZE905
ERRATA – PIC18F27/47/57Q83 Silicon Errata and Data Sheet Clarification Silicon Die Revision Addition
Microchip
零件编号: SYST- 22ULJY515
ERRATA – PIC18F27/47/57Q84 Silicon Errata and Data Sheet Clarifications Silicon Die Revision Addition
Microchip
零件编号: SYST- 28BMIN243
Data Sheet – SST26VF020A 2.5V/3.0V 2-Mbit Serial Quad I/O Flash Memory
Microchip
零件编号: KSRA- 08ZYLW084
CCB 4420 Final Notice: Implement new carrier tape width (24mm) for Atmel ATSAM4C32CA-AUR catalog part number (CPN) available in 100L LQFP (14x14x1.4mm) package tested at ASE9 and MPHL final test site.
Microchip
零件编号: KSRA- 13AKNI696
CCB 4440 Final Notice: Qualification of MMT as an additional assembly site for selected MTCH112, MTCH810 and PIC12xxxx device families available in 8L DFN (3x3x0.9mm) package.
Microchip
零件编号: LIAL- 18GBSB625
eSign # E000038680: End of Life (EOL) of CMFCLGF50X60CTAMF-AS and CMFCLGL100X120CBTAMF-AS catalog part numbers (CPN).
Microchip
零件编号: KSRA- 07HVQF409
CCB 4031 Final Notice: Qualification of Microchip Technology Tempe – Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.
Microchip
零件编号: PCN- 2021- 001
Introducing TH25Q-16HB-MSCI as an Alternative 16 Mb Flash for ESP8266 Module Series
Espressif
零件编号: PCN20025
Migration of Solder Paste for Package Decoupling Capacitors from RoHS to Sn/Pb for PolarFire Military Temperature Devices
零件编号: PDN20028
Libero Design Suite Software—Discontinuation of Support for Linux RHEL 6.6 Through RHEL 6.11 and CentOS 6.6 Through CentOS 6.11 Operating Systems
零件编号: RMES- 08OEQO165
CCB 4082.007 Final Notice: Qualification of MTAI as a new final test site for selected Microsemi products available in 48L LQFP (7x7x1.4mm) package.
Microchip