我们在情况变得紧急之前,就向您通报所代理制造商的 EOL 和 PCN。
需求评估和最后订购窗口的处理,确保万无一失。
替代方案建议和长期供货合同为您的批量生产保驾护航。
产品停产(End of Life)和产品变更(Product Change Notifications)是半导体行业的日常——关键在于及时获知。INELTEK 主动向客户通报所代理制造商的 EOL 和 PCN,并通过最后购买处理、替代方案建议和长期供货合同提供支持,确保您的批量生产供应不断。
包含所有停产和变更通知的可搜索数据库就在本页下方——可按类型和制造商筛选,并链接至原始文件。
您对某项具体停产通知有疑问或需要相关文件?请联系我们——我们将直接为您提供相关资料。
零件编号: SYST- 09TYIJ481
ERRATA – ATmega808/809/1608/1609 Silicon Errata and Data Sheet Clarification
Microchip
零件编号: SYST- 10QRAR381
ERRATA – ATmega4808/4809 Silicon Errata and Data Sheet Clarification
Microchip
零件编号: SYST- 10TSQD600
ERRATA – ATmega3208/3209 Silicon Errata and Data Sheet Clarification
Microchip
零件编号: ASER- 25FYQB098
CCB 4397 Final Notice: Qualification of MTAI as a new assembly site for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 8L SOIC (3.90mm) package.
Microchip
零件编号: ASER- 25RLDG830
CCB 4279.002 Initial Notice: Qualification of GTK as a new assembly site for selected SST39VF3201xx and SST39VF3202xx device families available in 48L TSOP (12x20mm) package.
Microchip
零件编号: ASER- 27LSSS520
CCB 4514 Initial Notice: Qualification of MTAI as an additional assembly site for selected MSCC products available in 48L VQFN (7x7x1mm) package.
Microchip
零件编号: JAON- 20DIBE102
CCB 4179 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA663454 and ATA663431 device families available in 16L VDFN (3×5.5x1mm) package.
Microchip
零件编号: JAON- 27OWHZ565
CCB 4533 Initial Notice: Qualification of MMT as a new assembly site for selected IS1677SM device family available in 40L VQFN (6x6x0.9mm) package using die #2 fabricated at Elite Semiconductor Microelectronics Technology (ESMT12) fab site.
Microchip
零件编号: LIAL- 08IMMO486
CCB 4508 Initial Notice: Qualification of NSEB as a new assembly site for selected ATTINY20, ATTINY40, AT42QT2120, AT42QT1070, AT42QT1050 device families available in 20L VQFN (3x3x0.85mm) package.
Microchip
零件编号: LIAL- 08RPHO713
CCB 3459.002 Final Notice: Qualification of MTAI as an additional assembly site for selected Micrel automotive products available in 32L VQFN (5x5x0.9mm) package.
Microchip
零件编号: LIAL- 09ERER337
CCB 4527 Initial Notice: Qualification of ASE as an additional assembly site for selected PM40xxx, PM41xxx and PM42xxx Microsemi device families available in 1467L BBGA (40x40x4.03mm) package.
Microchip
零件编号: LIAL- 23USLU235
CCB 3979 and 3979.001 Final Notice: Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly site.
Microchip
零件编号: RMES- 11LZPK817
CCB 4569 Final Notice: Qualification of MMT as an additional assembly site for ATA6663-FAQWxx device family available in 8L VQFN (3x3x1.0mm) package.
Microchip
零件编号: ASER- 05IJPW824
CCB 4556 Initial Notice: Qualification of SIGN as a new assembly site for selected SST39V320xx and SST38VF640xx device families available in 48L TSOP (12x20mm) package.
Microchip
零件编号: ASER- 09XMLZ090
CCB 4562 Initial Notice: Qualification of a new bill of materials (BOM) for selected PIC18Fxxx and PIC16Fxxx device families available in 128L LQFP (14x14x1.4mm) package at ANAP assembly site.
Microchip
零件编号: ASER- 25FYQB098
CCB 4397 Final Notice: Qualification of MTAI as a new assembly site for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 8L SOIC (3.90mm) package.
零件编号: RMES- 09AHZT744
CCB 4347.001 Final Notice: Implement new packing material (JEDEC tray) and packing changes for selected RN41Nxxx module.
Microchip
零件编号: SYST- 10ELHW772
Data Sheet – MIC23153 – 4MHz PWM 2A Buck Regulator with HyperLight Load® and Power Good
Microchip