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产品停产(End of Life)和产品变更(Product Change Notifications)是半导体行业的日常——关键在于及时获知。INELTEK 主动向客户通报所代理制造商的 EOL 和 PCN,并通过最后购买处理、替代方案建议和长期供货合同提供支持,确保您的批量生产供应不断。
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零件编号: SYST- 10FXRO272
Data Sheet – 24AA16H/24LC16BH/24FC16H 16K I2C Serial EERROM with Half-Array Write-Protect Data Sheet
Microchip
零件编号: SYST- 10IPXG475
Data Sheet – 24AA01/24LC01B/24FC01 1K I2C Serial EEPROM Data Sheet
Microchip
零件编号: SYST- 10MDRO647
Data Sheet – 24AA04/24LC04B/24FC04 4K I2C Serial EEPROM Data Sheet
Microchip
零件编号: SYST- 10SIQN022
Data Sheet – 24AA04H/24LC04BH/24FC04H 4K I2C Serial EEPROM with Half-Array Write-Protect
Microchip
零件编号: JAON- 04FTWF456
CCB 4540 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.
Microchip
零件编号: JAON- 04IGFH099
CCB 4542 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and gold (Au) bond wire material assembled at MMT assembly site.
Microchip
零件编号: JAON- 04TMOL584
CCB 4539 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.
Microchip
零件编号: KSRA- 04SQKB836
Memo Log # ML0220210001: Implementation of Catalog Part Numbers (CPN) convention changes for selected Microsemi High Reliability Discrete Solutions (HRDS) products including products with cage codes/manufacturer codes 43611/CDWR and SD633/CIRL.
Microchip
零件编号: KSRA- 25JAKY062
CCB 4495 Final Notice: Qualification of MTAI as a new assembly site for selected MCP25625 device family available in 28L QFN (6.0X6.0X0.9mm) package.
Microchip
零件编号: LIAL- 03QXCU643
CCB 3640.003 Final Notice: Qualification MTAI as a new final test site for AT89C5131A-S3SUL Atmel catalog part number (CPN) available in 52L PLCC (19.1×19.1×4.4mm) package.
Microchip
零件编号: JAON- 04DXFD964
CCB 4541 Final Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.
Microchip
零件编号: RMES- 22JKYM836
CCB 4270 Final Notice: Qualification of GTK as a new assembly site for selected Atmel products available in 28L SOIC (.300in) package.
Microchip
零件编号: GBNG- 06JPSY308
CCB 4204 Final Notice: Qualification of Microchip Technology Tempe – Fab 2 (TMGR) as a new fabrication site for selected Microsemi SG1524BN, SG2524Bxx and SG3524Bxx device families available in 16L PDIP (.300in) and 16L SOIC (.300in) packages.
Microchip
零件编号: KSRA- 29BDJE236
CCB 4239 Final Notice: Qualification of NSEB as a new assembly site for HV892K7-G catalog part number (CPN) available in 10L WDFN (4x4x0.8mm) package.
Microchip
零件编号: SYST- 04LQCK978
ERRATA – PIC16(L)F18855/18875 Family Silicon Errata and Data Sheet Clarification Document Revision
Microchip
零件编号: SYST- 05UNGD328
ERRATA – PIC32CM MC00 Family Data Sheet Clarifications and Silicon Errata
Microchip
零件编号: ASER- 25FYQB098
CCB 4397 Final Notice: Qualification of MTAI as a new assembly site for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 8L SOIC (3.90mm) package.
Microchip
零件编号: JAON- 27XQGL571
CCB 4470 Final Notice: Implement new carrier tape and reel for selected Atmel products available in 64L TQFP (14x14x1.0mm) package at ASE9 final test site.
Microchip
零件编号: 20210125
Notice of Our Supplier’s Improprieties regarding Certification of its Chemical Products, which Integrated into Epson’s Timing Device Products
Epson
零件编号: JAON- 18FUUS481
eSign # E000041067: End of Life (EOL) Notice of VSC3340XJJ-01 and VSC3340XJJ-31 Microsemi catalog part numbers (CPN).
Microchip