EOL & PCN
Il vostro servizio per il ciclo di vita
Informazione proattiva
Vi informiamo su EOL e PCN dei produttori che rappresentiamo prima che la situazione diventi critica.
Gestione del Last Time Buy
Rilevazione del fabbisogno e gestione dell'ultima finestra d'ordine, affinché nulla vada perso.
Alternative e contratti di fornitura
Proposte di alternative e contratti di fornitura a lungo termine garantiscono la vostra produzione in serie.
Le dismissioni di prodotti (End of Life) e le modifiche di prodotto (Product Change Notifications) fanno parte della quotidianità del settore dei semiconduttori: l'importante è saperlo in tempo. INELTEK informa attivamente i propri clienti su EOL e PCN dei produttori rappresentati e offre supporto con gestione del Last Time Buy, proposte di alternative e contratti di fornitura a lungo termine, affinché la vostra produzione in serie resti sempre approvvigionata.
Database EOL e PCN
Il database consultabile con tutte le dismissioni e le notifiche di modifica si trova qui sotto, in questa stessa pagina — filtrabile per tipo e produttore, con link ai documenti originali.
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Database EOL & PCN
Codice componente: JAON- 14PVXG212
CCB 3737 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected Atmel products available in 48L VQFN package at ASCL assembly site.
Microchip
Codice componente: JAON- 14SGUP622
CCB 4442.001 Initial Notice: Qualification of G631HQ mold compound material for Atmel AT8USDX6CDR-RUTU and AT8UA1184AE5-RUTU catalog part numbers (CPN) available in 144L LQFP (20x20x1.4mm) package.
Microchip
Codice componente: KSRA- 05LZRG100
CCB 4121 Final Notice: Qualification of HR-5104 die attach material for Micrel DSA1121WA1-100.0000VAO catalog part number (CPN) available in 6L VDFN (3.2×2.5×0.9mm) package at NSEB assembly site.
Microchip
Codice componente: KSRA- 09VMYP837
CCB 4154.001 Final Notice: Qualification of MMT as an additional assembly site for SST25VF080B-50-4C-PAE catalog part number (CPN) available in 8L PDIP package.
Microchip
Codice componente: KSRA- 10VTZM377
CCB 4507 Initial Notice: Qualification of MMT as an additional assembly site for selected products of MCP9844T and MCP98244T device family available in 8L TDFN (2x3x0.8mm ) package.
Microchip
Codice componente: KSRA- 15DGBH859
CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.
Microchip
Codice componente: KSRA- 15DGBH859
CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.
Microchip
Codice componente: KSRA- 15SEZS912
CCB 4245 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA57xx, ATA58xx, ATA82xx and ATA85xx device families available in 32L VQFN (5x5x1mm) package using palladium coated copper with gold flash (CuPdAu) bond wire
Microchip
Codice componente: KSRA- 16TFZQ917
CCB 4423 Final Notice: Qualification of MPHL as an additional final test site for Atmel ATSAMC21Nxxx and ATSAMC20Nxxx device families available in 100L TQFP (14x14x1mm) package.
Microchip
Codice componente: LIAL- 09UEWG307
CCB 4395 Initial Notice: Qualification of MMT as an additional assembly site for selected Micrel products available in 16L VQFN (3x3x1.00mm) package.
Microchip
Codice componente: LIAL- 12WRCV778
CCB 2927.001 and CCB 3280.002 Final Notice: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xC, AT24C128C, AT24C16C, AT24C256C, AT24C32D and AT24C64D device families available in 8L SOIC package.
Microchip
Codice componente: LIAL- 13ERYV184
CCB 4198.001 Final Notice: Qualification of ASSH as a new assembly site for selected 24xx01, 24xx02, 24xx04, 24xx08 and 24xx16 device families available in 8L TSSOP package.
Microchip
Codice componente: LIAL- 13ONQB759
Waterfall Miura-B1 Final Notice: Implement silicon die revision B1 and implement additional chip ID for selected ATSAMA5D3xx device families.
Microchip
Codice componente: LIAL- 14BIKU061
CCB 4510 Final Notice: Implement Microchip Part Aging Policy, Tape and Reel Combination rules, Label and Packing Changes for selected Microsemi High Reliability Discrete Solutions (HRDS) products
Microchip
Codice componente: LIAL- 14RZLJ133
CCB 4159 Final Notice: Implement Microchip Part Aging Policy, Recertification and Combination rules, Labels and Packing Changes for selected Microsemi Field Programmable Gate Array (FPGA) and Mixed Signal and ASIC(MSA) products
Microchip
Codice componente: LIAL- 15QPNY176
CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.
Microchip
Codice componente: LIAL- 15QPNY176
CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.
Microchip
Codice componente: LIAL- 21DKJL279
CCB 4439.001 and 4439.002 Final Notice: Qualification of MMT as an additional assembly site for selected products available 8L DFN (3x3x0.9mm) and (2x3x0.9mm) packages.
Microchip
Codice componente: LIAL- 24KOXB344
CCB 4477 Final Notice Implement additional cover tape, carrier tape and plastic reel material supplier for selected Micrel products available in 3L, 5L, 6L and 8L SOT23, 5L and 6L TSOP and 8L SOIC packages at STAR assembly site.
Microchip
Codice componente: LIAL- 29JCGD899
CCB 4439 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L DFN (4x4x0.9mm) package at MMT assembly site
Microchip
Codice componente: RMES- 11LXUY101
CCB 4532 Final Notice: Implement Microchip Top marking changes for selected Microsemi Field-Programmable Gate Arrays (FPGAs) products available in various packages.
Microchip
Codice componente: RMES- 13GXSA956
CCB 4441 Final Notice: Qualification of Elite Semiconductor Microelectronics Technology (ESMT12) as a new fabrication site for Die #2 of a multi-die IS1678xx device family available in 40L VQFN (6x6x0.9mm) package.
Microchip
Codice componente: RMES- 15KLMX168
CCB 4502 Initial Notice: Qualification of NSEB as a new assembly site for ATTINY43x, ATTINYx4x, ATTINYx313x, ATTINY84x, ATTINY1634x, ATTINY44x, ATTINY13x, ATTINY85x, AT73C508, ATTINY45x, ATTINY25x and QT14C10 device families available in 20L WQFN (4X4X0.8mm) package.
Microchip
Codice componente: RMES- 15ZREP293
CCB 3379.002 and CCB 3280.001 Final Notice: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xD, AT24C16D and AT24C32E device families available in 8L SOIC packages.
Microchip
Codice componente: RMES- 19RHZI746
CCB 4318 Final Notice: Qualification of ASCL as an additional assembly site for selected products available in 100L VQFN (12X12X0.9mm) package.
Microchip
