EOL & PCN
您的生命周期服务
主动告知
我们在情况变得紧急之前，就向您通报所代理制造商的 EOL 和 PCN。
最后购买（Last Time Buy）处理
需求评估和最后订购窗口的处理，确保万无一失。
替代方案与供货合同
替代方案建议和长期供货合同为您的批量生产保驾护航。
产品停产（End of Life）和产品变更（Product Change Notifications）是半导体行业的日常——关键在于及时获知。INELTEK 主动向客户通报所代理制造商的 EOL 和 PCN，并通过最后购买处理、替代方案建议和长期供货合同提供支持，确保您的批量生产供应不断。
EOL 与 PCN 数据库
包含所有停产和变更通知的可搜索数据库就在本页下方——可按类型和制造商筛选，并链接至原始文件。
您对某项具体停产通知有疑问或需要相关文件？请联系我们——我们将直接为您提供相关资料。
对某项具体停产通知有疑问？
索取资料
EOL & PCN 数据库
零件编号: JAON- 01PHJW963
Qualification of MTAI assembly site for selected products available in 64L QFN package with 311×311 and291x291 leadframe paddle size.
Microchip
零件编号: JAON- 04VUHY153
Qualification of NSEB as an additional assembly site for selected products in 16L QFN package.
Microchip
零件编号: JAON- 08PTJN759
Qualification of GTK assembly site for selected Supertex products using wafers with Au backside coating available in 3L TO-92 package
Microchip
零件编号: JAON- 15GNKR932
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 200K Wafer technology
Microchip
零件编号: JAON- 15OELO113
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 150K, 160Kand 250K wafer technologies
Microchip
零件编号: JAON- 29FMVF751
Qualification of GTK assembly site for selected Supertex products using wafers with non-Au backside coating available in 3L TO-92 package.
Microchip
零件编号: JAON- 29NMYO469
Qualification of ANAP assembly site for selected products available in 64L LQFP (10x10x1.4mm) package.
Microchip
零件编号: AON- 08OJZL283
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.25um TSMC wafer technology
Microchip
零件编号: JAON- 07YGZF687
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 200K Wafer technology
Microchip
零件编号: JAON- 13JEGV932
Qualification of palladium coated copper with gold Flash (CuPdAu) bond wire in selected products
零件编号: JAON- 13ZVEL987
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.25um TSMC wafer technology
Microchip
零件编号: JAON- 23PXEI807
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the B2CD2 Process Technology.
Microchip
零件编号: JAON- 25CNSA799
Qualification of ASE assembly site as an additional site for selected products available in 24L QFN (5x5x0.9mm) package.
Microchip
零件编号: JAON- 28LMTI435
Qualification of an additional fabrication site for AT9933 Supertex device family.
Microchip
零件编号: PC162501
Wafer Foundry Transfer, 58910(UMC) from 58901(LF) for 86RF231
Microchip - Atmel
