EOL & PCN
您的生命周期服务
主动告知
我们在情况变得紧急之前，就向您通报所代理制造商的 EOL 和 PCN。
最后购买（Last Time Buy）处理
需求评估和最后订购窗口的处理，确保万无一失。
替代方案与供货合同
替代方案建议和长期供货合同为您的批量生产保驾护航。
产品停产（End of Life）和产品变更（Product Change Notifications）是半导体行业的日常——关键在于及时获知。INELTEK 主动向客户通报所代理制造商的 EOL 和 PCN，并通过最后购买处理、替代方案建议和长期供货合同提供支持，确保您的批量生产供应不断。
EOL 与 PCN 数据库
包含所有停产和变更通知的可搜索数据库就在本页下方——可按类型和制造商筛选，并链接至原始文件。
您对某项具体停产通知有疑问或需要相关文件？请联系我们——我们将直接为您提供相关资料。
对某项具体停产通知有疑问？
索取资料
EOL & PCN 数据库
零件编号: JAON- 04DHCS000
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.18 and0.16um GF wafer technologies
Microchip
零件编号: JAON- 04TZJG885
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the0.25um TSMC wafer technology
Microchip
零件编号: JAON- 06GIVT816
Qualification of non-conductive die attach epoxy 8900NC for selected products available in 8L SOIC package at MMT assembly site
Microchip
零件编号: JAON- 06OHXH747
Qualification of MTAI assembly site as an additional site for selected Supertex products available in 8L MSOP package
Microchip
零件编号: JAON- 07PFIM777
Qualification of MTAI assembly site as an additional site for selected Supertex products available in 5L SOT-23 package
Microchip
零件编号: JAON- 12POCU264
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the150K and 160K wafer technologies
Microchip
零件编号: JAON- 12YAST529
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the 200K wafer technology
Microchip
零件编号: JAON- 15BYTH145
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 90K and 120K wafer technologies
Microchip
零件编号: JAON- 15OELO113
Qualification of palladium coated copper with Gold Flash bond wire in selected products of the150K and 160K wafer technologies
Microchip
零件编号: JAON- 15VCCB774
Qualification of palladium coated copper with Gold flashbond wire in selected products of the120K wafer technology
Microchip
零件编号: JAON- 20DZPV439
Qualification of palladium coated copper with Gold Flash bond wire in selected products of the 150K and 160K wafer technologies
Microchip
零件编号: JAON- 28UACW121
Qualification of ANAP as an assembly site for selected products available in 64L LQFP (10x10x1.4mm) package
Microchip
零件编号: JAON- 08DHBR103
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the B2M2 Process Technology
Microchip
零件编号: JAON- 11SIPZ900
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCDM Process Technology.
Microchip
零件编号: JAON- 12YAST529
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the 200K wafer technology
Microchip
零件编号: JAON- 13MUGT016
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCD12 Process Technology
Microchip
零件编号: JAON- 16TUGT945
Qualification of G600V molding compound for products available in 8L SOIC Chip-On-Lead package assembled at MTAI assembly site.
Microchip
零件编号: JAON- 17JDSD193
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 40K Wafer technology
Microchip
零件编号: JAON- 17ZAMW740
Qualification of EFTEC-64T lead-frame for selected products in 8L VDFN package at NSEB assembly site
零件编号: JAON- 22ZKEM744
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCD2 Process Technology
Microchip
零件编号: JAON- 24FRFP480
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCDSi Process Technology
Microchip
零件编号: JAON- 24XLPK873
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCC Process Technology
Microchip
零件编号: JAON- 26ABPQ300
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the CSI12 Process Technology
Microchip
零件编号: JAON- 26TTXD112
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BM2 Process Technology
Microchip
零件编号: JAON- 27DRIR445
Qualification of non-conductive die attach epoxy 8900NC for selected products available in 8L SOIC package at MTAI assembly site
Microchip
