EOL & PCN
Your life cycle service
Proactive information
We inform you about EOLs and PCNs from the manufacturers we represent before things become critical.
Last Time Buy handling
Demand assessment and handling of the final ordering window, so that nothing is lost.
Alternatives & supply agreements
Suggested alternatives and long-term supply agreements safeguard your series production.
Product discontinuations (End of Life) and product changes (Product Change Notifications) are part of everyday life in the semiconductor industry — what matters is finding out in time. INELTEK proactively informs its customers about EOLs and PCNs from the manufacturers it represents and supports them with Last Time Buy handling, suggested alternatives and long-term supply agreements, so that your series production stays supplied.
EOL and PCN database
You will find the searchable database of all discontinuations and change notifications right below on this page — filterable by type and manufacturer, with links to the original documents.
Do you have a question about a specific discontinuation or need a document? Contact us — we will provide you with the documents directly.
Question about a specific discontinuation?
Request documents
EOL & PCN database
Part number: JAON- 01PHJW963
Qualification of MTAI assembly site for selected products available in 64L QFN package with 311×311 and291x291 leadframe paddle size.
Microchip
Part number: JAON- 04VUHY153
Qualification of NSEB as an additional assembly site for selected products in 16L QFN package.
Microchip
Part number: JAON- 08PTJN759
Qualification of GTK assembly site for selected Supertex products using wafers with Au backside coating available in 3L TO-92 package
Microchip
Part number: JAON- 15GNKR932
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 200K Wafer technology
Microchip
Part number: JAON- 15OELO113
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 150K, 160Kand 250K wafer technologies
Microchip
Part number: JAON- 29FMVF751
Qualification of GTK assembly site for selected Supertex products using wafers with non-Au backside coating available in 3L TO-92 package.
Microchip
Part number: JAON- 29NMYO469
Qualification of ANAP assembly site for selected products available in 64L LQFP (10x10x1.4mm) package.
Microchip
Part number: AON- 08OJZL283
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.25um TSMC wafer technology
Microchip
Part number: JAON- 07YGZF687
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 200K Wafer technology
Microchip
Part number: JAON- 13JEGV932
Qualification of palladium coated copper with gold Flash (CuPdAu) bond wire in selected products
Part number: JAON- 13ZVEL987
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.25um TSMC wafer technology
Microchip
Part number: JAON- 23PXEI807
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the B2CD2 Process Technology.
Microchip
Part number: JAON- 25CNSA799
Qualification of ASE assembly site as an additional site for selected products available in 24L QFN (5x5x0.9mm) package.
Microchip
Part number: JAON- 28LMTI435
Qualification of an additional fabrication site for AT9933 Supertex device family.
Microchip
Part number: PC162501
Wafer Foundry Transfer, 58910(UMC) from 58901(LF) for 86RF231
Microchip - Atmel
