EOL & PCN
Your life cycle service
Proactive information
We inform you about EOLs and PCNs from the manufacturers we represent before things become critical.
Last Time Buy handling
Demand assessment and handling of the final ordering window, so that nothing is lost.
Alternatives & supply agreements
Suggested alternatives and long-term supply agreements safeguard your series production.
Product discontinuations (End of Life) and product changes (Product Change Notifications) are part of everyday life in the semiconductor industry — what matters is finding out in time. INELTEK proactively informs its customers about EOLs and PCNs from the manufacturers it represents and supports them with Last Time Buy handling, suggested alternatives and long-term supply agreements, so that your series production stays supplied.
EOL and PCN database
You will find the searchable database of all discontinuations and change notifications right below on this page — filterable by type and manufacturer, with links to the original documents.
Do you have a question about a specific discontinuation or need a document? Contact us — we will provide you with the documents directly.
Question about a specific discontinuation?
Request documents
EOL & PCN database
Part number: JAON- 04DHCS000
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.18 and0.16um GF wafer technologies
Microchip
Part number: JAON- 04TZJG885
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the0.25um TSMC wafer technology
Microchip
Part number: JAON- 06GIVT816
Qualification of non-conductive die attach epoxy 8900NC for selected products available in 8L SOIC package at MMT assembly site
Microchip
Part number: JAON- 06OHXH747
Qualification of MTAI assembly site as an additional site for selected Supertex products available in 8L MSOP package
Microchip
Part number: JAON- 07PFIM777
Qualification of MTAI assembly site as an additional site for selected Supertex products available in 5L SOT-23 package
Microchip
Part number: JAON- 12POCU264
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the150K and 160K wafer technologies
Microchip
Part number: JAON- 12YAST529
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the 200K wafer technology
Microchip
Part number: JAON- 15BYTH145
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 90K and 120K wafer technologies
Microchip
Part number: JAON- 15OELO113
Qualification of palladium coated copper with Gold Flash bond wire in selected products of the150K and 160K wafer technologies
Microchip
Part number: JAON- 15VCCB774
Qualification of palladium coated copper with Gold flashbond wire in selected products of the120K wafer technology
Microchip
Part number: JAON- 20DZPV439
Qualification of palladium coated copper with Gold Flash bond wire in selected products of the 150K and 160K wafer technologies
Microchip
Part number: JAON- 28UACW121
Qualification of ANAP as an assembly site for selected products available in 64L LQFP (10x10x1.4mm) package
Microchip
Part number: JAON- 08DHBR103
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the B2M2 Process Technology
Microchip
Part number: JAON- 11SIPZ900
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCDM Process Technology.
Microchip
Part number: JAON- 12YAST529
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the 200K wafer technology
Microchip
Part number: JAON- 13MUGT016
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCD12 Process Technology
Microchip
Part number: JAON- 16TUGT945
Qualification of G600V molding compound for products available in 8L SOIC Chip-On-Lead package assembled at MTAI assembly site.
Microchip
Part number: JAON- 17JDSD193
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 40K Wafer technology
Microchip
Part number: JAON- 17ZAMW740
Qualification of EFTEC-64T lead-frame for selected products in 8L VDFN package at NSEB assembly site
Part number: JAON- 22ZKEM744
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCD2 Process Technology
Microchip
Part number: JAON- 24FRFP480
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCDSi Process Technology
Microchip
Part number: JAON- 24XLPK873
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCC Process Technology
Microchip
Part number: JAON- 26ABPQ300
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the CSI12 Process Technology
Microchip
Part number: JAON- 26TTXD112
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BM2 Process Technology
Microchip
Part number: JAON- 27DRIR445
Qualification of non-conductive die attach epoxy 8900NC for selected products available in 8L SOIC package at MTAI assembly site
Microchip
