EOL & PCN

Teilenummer: JAON- 14PVXG212

CCB 3737 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected Atmel products available in 48L VQFN package at ASCL assembly site.

Microchip

Teilenummer: JAON- 14SGUP622

CCB 4442.001 Initial Notice: Qualification of G631HQ mold compound material for Atmel AT8USDX6CDR-RUTU and AT8UA1184AE5-RUTU catalog part numbers (CPN) available in 144L LQFP (20x20x1.4mm) package.

Microchip

Teilenummer: KSRA- 05LZRG100

CCB 4121 Final Notice: Qualification of HR-5104 die attach material for Micrel DSA1121WA1-100.0000VAO catalog part number (CPN) available in 6L VDFN (3.2×2.5×0.9mm) package at NSEB assembly site.

Microchip

Teilenummer: KSRA- 09VMYP837

CCB 4154.001 Final Notice: Qualification of MMT as an additional assembly site for SST25VF080B-50-4C-PAE catalog part number (CPN) available in 8L PDIP package.

Microchip

Teilenummer: KSRA- 10VTZM377

CCB 4507 Initial Notice: Qualification of MMT as an additional assembly site for selected products of MCP9844T and MCP98244T device family available in 8L TDFN (2x3x0.8mm ) package.

Microchip

Teilenummer: KSRA- 15DGBH859

CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.

Microchip

Teilenummer: KSRA- 15DGBH859

CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.

Microchip

Teilenummer: KSRA- 15SEZS912

CCB 4245 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA57xx, ATA58xx, ATA82xx and ATA85xx device families available in 32L VQFN (5x5x1mm) package using palladium coated copper with gold flash (CuPdAu) bond wire

Microchip

Teilenummer: KSRA- 16TFZQ917

CCB 4423 Final Notice: Qualification of MPHL as an additional final test site for Atmel ATSAMC21Nxxx and ATSAMC20Nxxx device families available in 100L TQFP (14x14x1mm) package.

Microchip

Teilenummer: LIAL- 09UEWG307

CCB 4395 Initial Notice: Qualification of MMT as an additional assembly site for selected Micrel products available in 16L VQFN (3x3x1.00mm) package.

Microchip

Teilenummer: LIAL- 12WRCV778

CCB 2927.001 and CCB 3280.002 Final Notice: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xC, AT24C128C, AT24C16C, AT24C256C, AT24C32D and AT24C64D device families available in 8L SOIC package.

Microchip

Teilenummer: LIAL- 13ERYV184

CCB 4198.001 Final Notice: Qualification of ASSH as a new assembly site for selected 24xx01, 24xx02, 24xx04, 24xx08 and 24xx16 device families available in 8L TSSOP package.

Microchip

Teilenummer: LIAL- 13ONQB759

Waterfall Miura-B1 Final Notice: Implement silicon die revision B1 and implement additional chip ID for selected ATSAMA5D3xx device families.

Microchip

Teilenummer: LIAL- 14BIKU061

CCB 4510 Final Notice: Implement Microchip Part Aging Policy, Tape and Reel Combination rules, Label and Packing Changes for selected Microsemi High Reliability Discrete Solutions (HRDS) products

Microchip

Teilenummer: LIAL- 14RZLJ133

CCB 4159 Final Notice: Implement Microchip Part Aging Policy, Recertification and Combination rules, Labels and Packing Changes for selected Microsemi Field Programmable Gate Array (FPGA) and Mixed Signal and ASIC(MSA) products

Microchip

Teilenummer: LIAL- 15QPNY176

CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.

Microchip

Teilenummer: LIAL- 15QPNY176

CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.

Microchip

Teilenummer: LIAL- 21DKJL279

CCB 4439.001 and 4439.002 Final Notice: Qualification of MMT as an additional assembly site for selected products available 8L DFN (3x3x0.9mm) and (2x3x0.9mm) packages.

Microchip

Teilenummer: LIAL- 24KOXB344

CCB 4477 Final Notice Implement additional cover tape, carrier tape and plastic reel material supplier for selected Micrel products available in 3L, 5L, 6L and 8L SOT23, 5L and 6L TSOP and 8L SOIC packages at STAR assembly site.

Microchip

Teilenummer: LIAL- 29JCGD899

CCB 4439 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L DFN (4x4x0.9mm) package at MMT assembly site

Microchip

Teilenummer: RMES- 11LXUY101

CCB 4532 Final Notice: Implement Microchip Top marking changes for selected Microsemi Field-Programmable Gate Arrays (FPGAs) products available in various packages.

Microchip

Teilenummer: RMES- 13GXSA956

CCB 4441 Final Notice: Qualification of Elite Semiconductor Microelectronics Technology (ESMT12) as a new fabrication site for Die #2 of a multi-die IS1678xx device family available in 40L VQFN (6x6x0.9mm) package.

Microchip

Teilenummer: RMES- 15KLMX168

CCB 4502 Initial Notice: Qualification of NSEB as a new assembly site for ATTINY43x, ATTINYx4x, ATTINYx313x, ATTINY84x, ATTINY1634x, ATTINY44x, ATTINY13x, ATTINY85x, AT73C508, ATTINY45x, ATTINY25x and QT14C10 device families available in 20L WQFN (4X4X0.8mm) package.

Microchip

Teilenummer: RMES- 15ZREP293

CCB 3379.002 and CCB 3280.001 Final Notice: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xD, AT24C16D and AT24C32E device families available in 8L SOIC packages.

Microchip

Teilenummer: RMES- 19RHZI746

CCB 4318 Final Notice: Qualification of ASCL as an additional assembly site for selected products available in 100L VQFN (12X12X0.9mm) package.

Microchip