We inform you about EOLs and PCNs from the manufacturers we represent before things become critical.
Demand assessment and handling of the final ordering window, so that nothing is lost.
Suggested alternatives and long-term supply agreements safeguard your series production.
Product discontinuations (End of Life) and product changes (Product Change Notifications) are part of everyday life in the semiconductor industry — what matters is finding out in time. INELTEK proactively informs its customers about EOLs and PCNs from the manufacturers it represents and supports them with Last Time Buy handling, suggested alternatives and long-term supply agreements, so that your series production stays supplied.
You will find the searchable database of all discontinuations and change notifications right below on this page — filterable by type and manufacturer, with links to the original documents.
Do you have a question about a specific discontinuation or need a document? Contact us — we will provide you with the documents directly.
| Type | Number | Manufacturer | Product family | Description / type designation | Published | Last time buy | Last time ship | |
|---|---|---|---|---|---|---|---|---|
| PCN | CC130202 | Microchip - Atmel | EPROM | Serial EEPROM Copper (Cu) Bond Wire Change for the AT24Cxxx; AT25xxx; AT93xxx | 24/01/2013 | |||
| PCN | RC130201 | Microchip - Atmel | Microcontroller | Add Copper Bonding Wire Capability for the AT91SAM9Gxxx Devices | 21/01/2013 | |||
| EOL | CE130301 | Microchip - Atmel | RF | EOL CryptoRF Package Option MVB1G for the AT88RFxxx and AT88SCxxxxCRF Devices | 18/01/2013 | 21.06.2013 | 21.01.2014 | |
| PCN | HC140301 | Microchip - Atmel | Transceiver | Update for ATA664151-WNQW | 17/01/2013 | |||
| PCN | SC125103 | Microchip - Atmel | special/divers | New Final Test Location for SmartPower Devices | 10/01/2013 | |||
| EOL | PTN_OPE_1301- 001 | Microchip - Atmel | special/divers | AT83C21GC144 Product Termination | 09/01/2013 | 30.06.2013 | 30.12.2013 | |
| EOL | PTN_OPE_1301- 001 |
SealSQ
|
Microcontroller | AT83C21GC144 | 09/01/2013 | 30.06.2013 | 30.12.2013 | |
| PCN | HC123401 | Microchip - Atmel | Transmitter | ESD Parameters Alignment to 3kV HBM 150V MM | 09/01/2013 | |||
| PCN | SC125104 | Microchip - Atmel | special/divers | New Minimum Ordering Quantity (MOQ) Numbers for SmartPower Devices | 08/01/2013 | |||
| EOL | CE125101 | Microchip - Atmel | RF | End-Of-Life (EOL) of the AT88SCxxxxCRF CryptoRF Devices | 02/01/2013 | 30.06.2013 | 31.12.2013 | |
| PCN | PDF- SF004 | Flash | Adesto® Serial Flash & DataFlash® Products Package Marking Change | 26/12/2012 | ||||
| EOL | CC124801 | Microchip - Atmel | EEPROM | AT24C1024B Industrial Temp Grade Serial EEPROM Layout Optimization and Device Enhancement | 21/12/2012 | 30.05.2013 | 30.11.2013 | |
| PCN | 140A00203 | Memory | WC32P040-XXM, Changed Figure 13 – 184 Lead, Ceramic Quad Flat | 13/12/2012 | ||||
| EOL | EOL_AS1320_AS1321_AS1325 | special/divers | EoL notification – AS1320/AS1321/AS1325 | 11/12/2012 | ||||
| EOL | PDF001 | Flash | 16-Mbit DataFlash® (AT45DB161D) Process Geometry Shrink and Device Enhancement – REVISED | 07/12/2012 | 30.04.2013 | 30.07.2013 | ||
| EOL | PDF002 | Flash | 2-Mbit DataFlash® (AT45DB021D) Process Geometry Shrink and Device Enhancement – REVISED | 07/12/2012 | 30.04.2013 | 31.07.2013 | ||
| EOL | HC124501 | Microchip - Atmel | Transceiver | Wafer Fab Transfer to Atmel Colorado Springs for ATA5823*, ATA5824* & EOL of the TSG Product Ver | 05/12/2012 | 31.12.2012 | 31.12.2013 | |
| EOL | CC123803A | Microchip - Atmel | EEPROM | AT24C01B and AT24HC02B Serial EEPROM Process Geometry Shrink and Device Enhancement | 28/11/2012 | 26.05.2013 | 26.11.2013 | |
| EOL | HC124602 | Microchip - Atmel | Transceiver | ATA6622_ATA6626 Wafer Fab Transfer to Atmel Colorado Springs and EOL TSG Product Version | 27/11/2012 | 31.12.2012 | 31.12.2013 | |
| EOL | CC123803 | Microchip - Atmel | EEPROM | 1-Kbit & 2-Kbit Two-wire Interface Industrial Temp Grade Serial EEPROM Process Geometry Shrink a | 26/11/2012 | 26.05.2013 | 26.11.2013 | |
| EOL | HC121801C | Microchip - Atmel | Driver | Changeto an Assembly Subcontractor for the ATA6826C-TUQY-66 | 16/11/2012 | N/A | N/A | |
| EOL | WE123507A | Microchip - Atmel | Microcontroller | End-of-Life for the AVR Development Tool Kits | 16/11/2012 | 28.02.2013 | 30.08.2013 | |
| PCN | PCN 35- 2012 | special/divers | Copper-Wire Bonding for QFN packages for AS3606x-BQFT / AS3607x-BQFT | 15/11/2012 | ||||
| EOL | CE124201 | Microchip - Atmel | special/divers | EOL for the AT88CK44REDCryptoAuthentication USB Dongle Demo Kit | 14/11/2012 | 31.12.2012 | 31.12.2012 | |
| PCN | 140A00204 | Memory | WED3C755E8MCX-XBX(-XBHX) power consumption change. | 12/11/2012 |
Part number: CC130202
Serial EEPROM Copper (Cu) Bond Wire Change for the AT24Cxxx; AT25xxx; AT93xxx
Microchip - Atmel
Part number: RC130201
Add Copper Bonding Wire Capability for the AT91SAM9Gxxx Devices
Microchip - Atmel
Part number: CE130301
EOL CryptoRF Package Option MVB1G for the AT88RFxxx and AT88SCxxxxCRF Devices
Microchip - Atmel
Part number: SC125104
New Minimum Ordering Quantity (MOQ) Numbers for SmartPower Devices
Microchip - Atmel
Part number: CE125101
End-Of-Life (EOL) of the AT88SCxxxxCRF CryptoRF Devices
Microchip - Atmel
Part number: CC124801
AT24C1024B Industrial Temp Grade Serial EEPROM Layout Optimization and Device Enhancement
Microchip - Atmel
Part number: PDF001
16-Mbit DataFlash® (AT45DB161D) Process Geometry Shrink and Device Enhancement – REVISED
Part number: PDF002
2-Mbit DataFlash® (AT45DB021D) Process Geometry Shrink and Device Enhancement – REVISED
Part number: HC124501
Wafer Fab Transfer to Atmel Colorado Springs for ATA5823*, ATA5824* & EOL of the TSG Product Ver
Microchip - Atmel
Part number: CC123803A
AT24C01B and AT24HC02B Serial EEPROM Process Geometry Shrink and Device Enhancement
Microchip - Atmel
Part number: HC124602
ATA6622_ATA6626 Wafer Fab Transfer to Atmel Colorado Springs and EOL TSG Product Version
Microchip - Atmel
Part number: CC123803
1-Kbit & 2-Kbit Two-wire Interface Industrial Temp Grade Serial EEPROM Process Geometry Shrink a
Microchip - Atmel
Part number: HC121801C
Changeto an Assembly Subcontractor for the ATA6826C-TUQY-66
Microchip - Atmel
Part number: PCN 35- 2012
Copper-Wire Bonding for QFN packages for AS3606x-BQFT / AS3607x-BQFT
Part number: CE124201
EOL for the AT88CK44REDCryptoAuthentication USB Dongle Demo Kit
Microchip - Atmel