Winbond – Flash & DRAM Memory: Cooperation between Winbond and Ineltek has fully started on 1st of January 2025 to share innovation in memory technology to European customers. In 1987 Winbond was established and has been listed on Taiwan Stock Exchange since 1995.
Winbond covers research & development, product design and wafer production (2 x 12” Fabs) in house. With their broad experience in memory and logic integrated circuits their portfolio covers a wide range of memory products.
These products are used in handheld devices, consumer electronics, computer peripherals and for challenging applications in automotive and industrial electronics extensively.
With its comprehensive experience and know-how in memory solutions Winbond has developed products of three main categories
Since there are so many different parts available we only want to give you a rough overview here.
For data and code storage Winbond is offering a broad portfolio of Serial NOR and NAND Flash products as well as multi-chip packages (MCP) combining both memory types.
NOR Flash is available in densities from 512kb up to 2Gb and with different interface data widths from x1 to x8.
Standard SPI (W25x) is offered as well as a high performance Octal DDR interface (W35T) for high performance XiP applications with a bandwidth up to 400MB/s.
In general, the NOR Flash memories are available for 1.2V, 1.8V and 3V designs.
With W74M Series applications the need for higher security can be realised. This family integrates an authentication IC with OTP key storage, monolithic counters and an engine for the HMAC SHA-256 algorithm alongside the flash memory.
There are also a lot of automotive options available with products meeting requirements up to ISO26262 ASIL-D.
The NAND flash portfolio covers densities from 512Mb up to 8Gb and offers the data bus widths x4 and x8.
It is worth to mention that Winbond’s QSPI NOR and QSPI NAND (W25N) are pin compatible. In addition, their basic instruction set is compatible too. This makes them ideal for application having the need for a memory size beyond the common NOR densities. In its 2nd generation the data throughput was increased to 83 MB/s.
If higher data rates are needed the W35N Octal NAND products offer data transfer speeds up to 240 MB/s in continuous read operation.
This SLC based products have excellent data integrity and data retention of more than ten years. They are specified to perform more than 100,000 program/erase cycles.
The W29N SLC NAND products come with a standard ONFI NAND command set to be used as a drop-in replacement for applications needing 1Gb up to 8Gb memory densities. Winbond offers 1-bit ECC and 4-bit ECC options.
For applications with special needs on the mechanical footprint Winbond has integrated a 1.8V NAND with a 1.8V LPDDR2 or LPDDR4x memory into a multi-chip package (MCP). For more details on W71N Series please contact our team.
The SpiStack® W25M family covers homogeneous memories with a stack of SPI or NAND flash dies and heterogeneous products which integrate NOR and NAND flash into one package.
By stacking multiple dies of one memory technology the increase of the data rate is possible.
Using both types of flash makes an application more flexible and use cases can be optimized.
On our overview page you can find dedicated links to the different Winbond code storage flash memory products.
Winbond’s DRAM line-up can be divided into mobile DRAM covering PSRAM, HYPERRAM™ and LPSDR to LPDDR4X products and specialty DRAM covering SDR to DDR4.
With focus on a low IDD current value Winbond helps to extend battery live in mobile applications. The HYPERRAM™ is a compact alternative to traditional PSRAM memories in IoT and consumer products. With its hybrid sleep mode (HSM) a standby power down to 35µW can be achieved. In addition, the signal pin count is far less – 13 compared to 31 signal pins in PSRAM. This enables much smaller packages sizes.
With its LPDDR4x products Winbond offers high performance with up to 4267Mbps with x32 and x16 data width options
The operating temperature of -40°C to +105°C makes it robust for modern Edge AI tasks even in the automotive applications.
With the clear focus on low and mid densities, rich feature set and high performance & speed Winbond covers densities from 64Mb to 4Gb for industrial and automotive usage. The latest DDR4 SDRAM offers speeds up to 3200Mbps.
If you would like to get into more details of each families use the links on our overview page.
With W77Q Series Winbond offers substantial security while W77F offers a very high security level. In the connected world and the IoT it is important to consider security aspects in these days. Due to new regulations in different regions of the world, security becomes more and more mandatory and stays no longer only a best practice. In the European Union it is required to meet the Radio Equipment Directive Delegated Act (RED DA) from August 2025 onwards. It prepares the Cyber Resilience Act (CRA) becoming active in 2027.
W77Q Series can be used as a drop-in replacement for W25Q series which saves a lot of time working on the compliance to the new regulations. It offers a Common Criteria EAL 2+ level. Winbond already considered the possible needs of the future. When it comes to post quantum cryptography (PQC) they achieve CNSA 2.0 compliance in this series for densities of 256Mb and above. W77Q parts are ISO26262 ASIL-C ready and Winbond works on ISO 21434 to meet the needs in cyber security in the automotive space.
W77F Series targets applications like integrated secure elements, UICCs, ePayment, Smart Meter Gateways, eID and more. Achieving Common Criteria EAL 5+ and being PSA certified level 2 since 2020 already shows how proven this solution is. Features like secure XiP, very high resistance against hardware and software attacks (SESIP Level 3 certified) and a mutual authentication with the host SoC protect your application on the highest possible level.
Additional details you find on our overview page.
In this article we can give only a rough overview about this broad product line-up. With the focus on memory products for more than 3 decades Winbond offers memories which guarantee innovation to your products based on latest technology. High performance, low power operation, special features and security options give your products an advantage in performance.
Get in contact with us directly or send us your request for Winbond – Flash & DRAM memory products here