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AT91SAM7A3-AU Device Will Be Discontinued
AT91SAM7S32 Revision and Ordering Code Change
AT91SAM7S64 Revision and Ordering Code Change
AT91SAM7S64 Revision and Ordering Code Change
ATmega2561 & ATmega2560 Transfer of Manufacturing Operations
End-Of-Life (EOL) of the ATTINY261V-10 and ATTINY261-20MU/MUR/PU/SU/SUR
Migration to Marketing Revision Level B of the AT91SAM7SE32
Speed Increase for theAT32UC3A and AT32UCA3 Product Families
1-Kbit & 2-Kbit Two-wire interface Industrial Temperature Grade (-40C to 85C) Serial EEPROM (AT2
Add AS for 40L PDIP for the Microcontroller, EPROM & EPLD Products
Add ATMEL Colorado Wafer Fab to Manufacture ATmega16A, Atmega32A
Add ATMEL Rousset (FR) for Selected AVR Product Manufacturing; ATmega8/32/48/88/168
Add ATP (Amkor Philippines) for the AT90PWM81and AT90PWM161 SOIC 20L Final Test Location
Add automatic test equipment(ATE) platform of final test(FT) for I941xxxDI series products
Add Copper Bonding Wire Capability for the AT91SAM9Gxxx Devices
Add Copper Bonding WireCapability AT91SAM9* ARM Microcontrollers
Add Qualified Subcon for 28QFN 4×4 MCU Assembly & Test, ATMEGA48
Add TFME as new assembly and testing site for N76E003AT20 product
Add UTAC, Thailand for theUC3L Devices Final Test Location
Adding Copper Bonding Wire Capability for Selected ARM Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Addition of Amkor Technology(China) as a Qualified Subcontractor
Addition of ASE Korea as a Supplier, ATTINY13, ATTINY23, ATTINY24, ATTINY25, ATTINY43, ATTINY44,
Addition of ATP (Amkor Philippines) Final Test Location for Amsterdam AT32UC3A0 and AT32UC3A1
Addition of ATP (Amkor Philippines) Final Test Location for Amsterdam AT32UC3A0 and AT32UC3A1
Addition of Semiconductor Manufacturing International Corporation
Addition of Semiconductor Manufacturing International Corporation for AVR MCU Products
Addition of SMIC (China) Wafer Fabrication Facility for Selected AVR Product Manufacturing
Addition of SMIC WaferFabrication Facility for Selected AVR Product Manufacturing
Addition of SMIC WaferFabrication Facility for Selected AVR Product Manufacturing
Addition of UTAC (UTL3Thailand) Final Test Location for ATTinyx5 20QFN Product Family
Addition of UTAC Thailand for the ATMEGA16U4 & ATMEGA32U4 44 QFN Final Test Location
AT32UC3A0512 Design Fix
AT83C21GC144
AT89LP51 and AT89LP52 8-bit MCU Design Revision-C
AT91SAM7X Revision and Ordering Code Change
AT91SAM7XC128 and AT91SAM7XC256 Revision and Ordering Code Chang
AT91SAM9260 DATASHEETSUPDATE
AT91SAM9261 Revision and Ordering Code Change
AT91SAM9263B-CU Package Transition
AT91SAM9CN12 Migration to Revision B
AT91SAM9G20 Revision and Ordering Code Change
AT91SAM9G45 Migration to Revision C
AT91SAM9G46 Migration to Marketing Revision Level B
AT91SAM9G46 Migration to Revision B
AT91SAM9M10B Migration to REVISION C
AT91SAM9M10B Migration to REVISION C
AT91SAM9M10B Migration to Revision C
AT91SAM9M11 Migration to Marketing Revision Level B
AT91SAM9M11 Migration to Marketing Revision Level B
ATmega128 Test Limit Change
ATmega16HVB and ATmega32HVBRevision Change from Revision B to Revision E
ATmega2561 Transfer of Manufacturing Operations
ATmega8 Test Limit Change
ATMXT640T FIRMWARE UPDATE FROM v1.6.AA TO v1.7.AA
ATMXT641T FIRMWARE UPDATE FROM v1.6.AA TO v1.7.AA
ATS91AM9G45B Migration to Revision C
ATSAM3U1 and ATSAM3N1- Migration to Marketing Revision Level B
ATxmega Microcontroller Final Test Transfer to ASE Kaohsiung-Taiwan and ASE-Korea
ATxmega Microcontroller Final Test Transfer to ASE Kaohsiung-Taiwan and ASE-Korea
ATxmega Microcontroller Final Test Transfer to ASE Kaohsiung-Taiwan and ASE-Korea
Automotive ATMEGA164P, ATMEGA324P, ATMEGA644P ADC Upgrade
Automotive ATMEGA164P, ATMEGA324P, ATMEGA644P ADC Upgrade
Automotive ATtiny87 ATtiny167 with LIN2.1 Slave Mode Break Field Detection Correction
AVR MCU Product Change from Gold to Copper Bonding Wire
AVR Microcontroller Design Revision
AVR Microcontroller Design Revision
C51 0.5µ ROMless/ROM/OTP EOL / AT80C, TS80C, AT83C, AT87C
Change Product Part Number due to Change on the Coding Matrix. Change from ACT8865QI303-T to
Change Product Part Number due to Change on the Coding Matrix. Change from ACT8945AQJ303-T to
Data Sheet – ATtiny24A/44A/84A – Complete Datasheet
Data Sheet – SAM3X8ERT Radiation-Tolerant 32-bit Arm® Cortex®-M3 Microcontroller
Die Revision Change for ATxmega128A3U
Die Revision Change for ATxmega128D3
Die Revision Change for ATxmega128D3
Die Revision Change for ATxmega128D3
Die Revision Change for ATxmega16D4 / ATxmega32D4
Die Revision Change for ATxmega16D4 / ATxmega32D4
Die Revision Change for ATxmega16D4 / ATxmega32D4
Die Revision Change for ATxmega16D4 / ATxmega32D4
Die Revision Change for ATxmega192D3
Die Revision Change for ATxmega256D3
Die Revision Change for ATxmega64A3U
Die Revision Change for ATxmega64D3
Die Revision Change for ATxmega64D3
Die Revison Change for ATxmega64A4U
Discontinuation of Specific Engineering Samples for SAMDA1
End of Life (EOL) of selected Atmel ATSAMA5Dxx device family.
End of Life of 32SOIC and 44TSSOP packages
End-Of-Life (EOL) notification of AT98AK032CTUSB series
End-Of-Life (EOL) of SAM7XC
End-Of-Life (EOL) of SAM7XC
End-of-life and Replacement of MARC4 ICs by Metal Mask Versions
End-of-life and Replacement of MARC4 ICs by Metal Mask Versions
End-Of-Life for the AT91FR40162SB ARM7TDMI Flash Microcontroller
End-Of-Life for the AT91FR40162SB ARM7TDMI Flash Microcontroller
End-Of-Life for the AT91SAM7A1 ARM7TDMI-based Microcontroller
End-Of-Life for the AT91SAM9261SB ARM926-based embedded MPU
End-of-Life for the AVR Development Tool Kits
End-of-Life for the AVRDevelopment Tool Kits
End-Of-Life for the U211B-MY
EOL AT89C5132 And The Associated Kit AT89DVK-04
EOL AT91M63200 and AT91M43300 ARM7TDMI Microcontrollers
EOL AT91R40807 ARM7TDMI Microcontroller
EOL AT91SAM7L128-WP15
EOL AT91SAM7XC-EK Evaluation Kit
EOL AT97SC3203_AT97SC3203S TCGTPM Devices
EOL ATAVRMC200 Evaluation Kit
EOL ATAVRRAVEN, ATAVRRZRAVEN, ATAVRRZ541, ATAVRRZ502, ATAVRRZ201 Evaluation Kits
EOL ATTiny Part Numbers
EOL Devices ATR7032, U4089B,U4090B, T4090B, U3600BM & Associated Development Kits
EOL Devices Used to Conduct SecureTtransitions, AT8356, AT91SC
EOL Evaluation Kits for ARM7TDMI-based Microcontrollers
EOL for the U3280M Package Version
EOL of AT32AP700x AP7Device Family
EOL of AT88SA
EOL of AT88SC series
EOL of AT90SCR050
EOL of AT91SAM7Lxxx
EOL of ATSAM3X-EK evaluation kit
EOL of ATtiny1634-UU/R
EOL of MEGA88V
EOL of MXT768E-CUR
EOL of the T7906E Single Point to Point IEEE 1355 High Speed Controller
EOL of the TSS901E Triple Point to Point IEEE 1355 High Speed Controller
Epson discontinuation of long time no order parts
ESP8266 modules AT bin upgrade to V1.7.3
Fab change for AT91R40008
Fab Change for AT91SAM7S256D and AT91SAM7S128D
Fab Change for AT91SAM9260B
Gold Bond Wire Diameter Reduction for Industrial 8 bit Microcontroller (C51 and AVR) Products
Lead-frame, Mold compound material, Chip thickness
MCU Test, AT89, ATMEGA12, ATMEGA16, ATMEGA32, ATMEGA64, ATMEGA85, ATXMEGA12, ATXMEGA16, ATXMEGA3
MCU Test, AT89, ATMEGA12, ATMEGA16, ATMEGA32, ATMEGA64, ATMEGA85, ATXMEGA12, ATXMEGA16, ATXMEGA3
Mercury 32-bit Monolithic Microcontroller Product End of Life
Microcontroller Part Number Change, SL383 Replaced by Part Number Suffix
Microcontroller Part Number Change, SL383 Replaced by Part Number Suffix
Migration of ATSAME3S1 from Revision A to Revision B
Migration to AT91SAM9G45 Revision B
Migration to AT91SAM9G45 Revision B
Migration to AT91SAM9G45Revision B
Migration to AT91SAM9M10 Revision B
Migration to Marketing Revision Level B of the AT91SAM7SE512 and AT91SAM7SE256
Migration to Marketing Revision Level B of the AT91SAM7X512
Migration to Marketing Revision Level B of the AT91SAM7X512
Migration to Marketing Revision Level B of the AT91SAM7X512
Migration to Marketing Revision Level C of the AT91SAM7X128 and AT91SAM7X256
Migration to Marketing Revision Level C of the AT91SAM7X128 and AT91SAM7X256
Migration to Marketing Revision Level D of the AT91SAM7S256 & AT91SAM7S128
Migration to MarketingRevision Level B of the AT91SAM7SE32
Migration to MarketingRevision Level D of the AT91SAM7S256 & AT91SAM7S128
Migration toAT91SAM9M10 Revision B
Modifications to AT90PWM216 and AT90PWM316 Datasheet
Moisture Sensitivity Level 1 for Automotive Devices in SO 8 Leads Package
Nuvoton PCN_N32926
Package Testing for ATmega1284, ATmega16, ATmega162, ATmega164, ATmega32, ATmega324, ATmega644,
Package Testing for ATmega1284, ATmega16, ATmega162, ATmega164, ATmega32, ATmega324, ATmega644,
Package Testing for ATmega1284, ATmega16, ATmega162, ATmega164, ATmega32, ATmega324, ATmega644,
PDIP24/PDIP20 (300 mil) packages
PDN for ATM90E25
PDN of ATA664251 and Evaluation Kit
Product Number Change Notice
Production site will be changed from Iwate plant to Mie plant
Production site will be changed from Iwate plant to Mie plant
PTN for the MB86H50/51
Quali. of Testing for ATmega1280, ATmega2560, ATmega3250, ATmega3290, ATmega640, ATmega6490, ATm
Qualification of Microchip Technology Tempe – Fab2 (TMGR) as an additional fabrication site for selected Atmel products
Qualification of MMT as a new assembly site for selected Atmel products available in 40L PDIP (600 mils) package
Qualification of MMT as an additional assembly site for selected MITCH112. MITCH180, PIC10xxxx and PIC12xxxx products available in 8L DFN (3x3x0.9mm and 2x3x0.9mm) package
Qualification of MMT as an additional Assembly site for selected products available in 16L (3x3x0.5mm), 16L (4x4x0.5mm), 20L (4x4x0.5mm) and 28L (4x4x0.5mm) packages
Qualification of MTAI as an additional assembly site for selected Atmel products available in 8L SOIJ package.
Qualification of MTAI assembly site for selected products available in 64L QFN package with 311×311 and291x291 leadframe paddle size.
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the 200K wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the 200K wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the0.25um TSMC wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the150K and 160K wafer technologies
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.25um TSMC wafer technology
Qualification of palladium coated copper with Gold Flash bond wire in selected products of the 150K and 160K wafer technologies
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 200K Wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 90K and 120K wafer technologies
Qualification of Testing for ATmega1280, ATmega2560, ATmega3250, ATmega3290, ATmega640, ATmega64
Qualification of UMC Fab 8N as an additional fabrication site for various Atmel catalog part numbers
Replace AT88SA102S with ATSHA204
SAM4E rev B
Selected MCU development kit EOL
Technology Shrink of Automotive Microcontrollers Product ATMega48/88/168 and ATMega164P/324P
Technology Shrink of Automotive Microcontrollers Product ATMega48/88/168 and ATMega164P/324P
Test Location Change of AVR MCU Parts Tested at Atmel San Jose Facility to ASET (ASE-Kaoshiung-T
Test Location Change of AVR MCU Parts Tested at Atmel San Jose Facility to ASKR (ASE-Korea)
TestLocation Change of AVR MCU Parts Tested at Atmel San Jose Facility to ASKR(ASE-Korea)
TestLocation Change of AVR MCU Parts Tested at Atmel San Jose Facility to ASKR(ASE-Korea)
Wafer Fab Transfer to Atmel Colorado Springs for ATA6612*, ATA6613*, ATA6616*, ATA6617* and EOL
Wafer Fab Transfer to Atmel Colorado Springs for ATA6612*, ATA6613*, ATA6616*, ATA6617* EOL of t
Wafer Foundry Transfer from LFoundry to UMC
Wafer Foundry Transfer from LFoundry to UMC
Adding Copper Bonding Wire Capability for Selected ARM Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
(DE) Adding Copper Bonding Wire Capability for Selected Microcontrollers
(DE) Adding Copper Bonding Wire Capability for Selected Microcontrollers
Addition of ASET as test facility for MEGA2564RFR2, MEGA1284RFR2,
Additional manufacturing location and die revision for selected ATmega48, ATmega88, ATmega168 and ATmega328 microcontrollers
AT90SCR200_new Metal 3 reticule mask to improve Yield
AT91RM9200 Migration to UMC Foundry
AT91SAM9G45 and AT91SAM9M10 MRL C Marking
(DE) AT91SAM9G45 Migration to Revision C
ATMEGA128RFA1 Rev D to F
ATmega8HVA and ATmega16HVA. EOL with no
ATMXT1066T2 Firmware Revision Change from v1.3.AA to v1.4.AA
(DE) ATMXT336T & ATMXT224T FIRMWARE REVISION CHANGE FROM V3.0.AB TO V3.1.AA
(DE) Change in Package Marking for Selected AVR XMEGA D4/D3/A4U Microcontrollers
End of Life Notification of AT91SAM7L-STK
End-of-Life (EOL) of 8051 MCU with PDIP40 package
End-Of-Life (EOL) of AT91SAM9260-CFU
End-Of-Life (EOL) of AT91SAM9260B-CFU
End-Of-Life Notification of FT510Eb, FT510Fb, FT511Ab, FT511Bb, FT511Db, FT531Ja, FT533Ia
End-of-Life of ATA663211-FAQW
End-of-Life of ATEVK2100A
EOL (End-Of-Life) Notification of ATSAMG53-XPRO
(DE) Fab and Assembly Location Change for ATmegaXXXRFR2
(DE) Introduction of SAM9XE Marketing Revision (MRL) B
Migration of ATSAM3S1 from Revision A to Revision B
Migration of die 58U75 to 63909 and 63910
New Errata in SAM D20 Revisions D and E and Update to NVM User Row Mapping
(DE) New wafer fabrication facility and die revision for ATmega48PB, ATmega88PB and ATmega168PB
(DE) Nuvoton EOL
SAM G51 comes with Factory Programmed Bootloader
(DE) SAM7X256/128 Rev C – Wafer Foundry Transfer from LFoundry to UMC
SAM7XC512 manufacturing transferred to UMC 8C.
(DE) Termination of creating new masks for MCU
(DE) WC142802-Cu-Wire-PCN-for-Selected-MCU.pdf