If you’re interested in:
while avoiding supply shortages during allocation times, you should consider GUC – The Advanced ASIC Leader.
As representatives, we support GUC in offering this advanced technology in Europe. Ineltek is your direct point of contact for questions about GUC’s services and capabilities. As their distributor, we take care of all the logistics to secure and maintain your supply chain. But who is GUC?
GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC services, listed on the Taiwan Stock Exchange (TWSE) under the code “3443”.
Taiwan Semiconductor Manufacturing Co. (TSMC) is GUC’s largest shareholder, owning 35% of the company shares. Thanks to this close relationship with TSMC, GUC can overcome various challenges from development to manufacturing of ASICs. GUC has access to the world’s leading semiconductor processes, complex packaging technologies, and guaranteed capacity.
The design service cover every stage of the process such as “Spec-in” and SoC (System-on-Chip) integration, physical implementation, complex packaging technologies (APT), turnkey manufacturing, as well as world-leading technologies like HBM (High-Bandwidth Memory) and Die-to-Die Interconnect IPs.
GUC offers 7nm, 5nm, and even 3nm production. TSMC also provides automotive qualified processes to their capabilities which extends the possible applications to highly intensive environments like autonomous driving.
Of course, larger structure widths are also supported for ASIC implementation to meet current requirements in industrial, telecommunications/network, and consumer applications.
In addition to ASIC design services, GUC also offers packaging and corresponding production management as an exclusive partner of TSMC.
The design service can be accessed from the earliest phase of your project if you don’t have an in-house ASIC design team, or you can provide your Net-List if you’re already working with an external partner on your ASIC development. With experience from over 200 new tape-outs since 2016, GUC can advise you on selecting suitable in-house and third party IP.
If you want to set your own IP on a future-proof process technology, GUC supports you in implementing your Net-List into an ASIC on a TSMC process suitable for your application.
In addition to IC implementation, GUC also supports you in packaging with many years of experience. In complex packaging technologies—like the TSMC-developed CoWoS (Chip-on-Wafer-on-Substrate)—GUC has developed over 50 successful multi-chip projects. Using this technology, different SoCs and associated memory can be connected in a very small footprint. GUC’s in-house IP for HBM2/3 PHY & Controller, GLink-2.5D/3D, and SerDes high-speed interfaces are proven solutions.
Finally, GUC provides support for testing, yield improvement, quality and reliability control. Through its strategic alliance with TSMC, Amkor, Ardentec, the ASE Group, KYTEC, and other partners, GUC guarantees comprehensive supply chain management for your project.
Do you have more questions? Contact us directly or send us your inquiry using the following form. We’ll get in touch with you promptly.