Customized Memory Solutions – DRAM

Winbond Electronics Corporation (“Winbond”) was established in 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park (CTSP), Taichung, Taiwan and operates two 12-inch highly intelligent and automated fabs located in CTSP and South Taiwan Science Park (STSP)’s Kaohsiung Science Park.

Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals and in challenging applications of in automotive and industrial electronics.

Customized Memory Solutions - DRAM (Mobile DRAM & Specialty DRAM)

Winbond categorized its DRAM Portfolio (so called Customized Memory Solutions) into 2 categories:

Mobile DRAM

By te development of mobile DRAM devices with a low IDD current value, Winbond helps to extend mobile DRAM memory applications beyond the mobile phone and tablet market to areas of mobile consumer electronics and mobile communication.

• PSRAM (64Mb to 256Mb) @1.8V
• HYPERRAM™ (32Mb to 512Mb) @ 1.8V / 3V
• LPSDR (128Mb to 512Mb @ 1.8V
• LPDDR1 (128Mb to 1Gb) @1.8V
• LPDDR2 (256Mb to 2Gb) @1.8V / 1.2V
• LPDDR3 (1Gb) @1.8V / 1.2V
• LPDDR4 (2G to 4Gb) @ 1.8V / 1.1V / 1.1V
• LPDDR4X (2G to 4Gb) @ 1.8V / 1.1V / 0.6V

Speciality DRAM

Specialty DRAM, focusing on low and middle density, features characteristics of high performance and high speed and is widely used by leaders in the consumer, communication, computer peripheral, industrial, and automobile markets. The latest DDR4 Memories reach speeds up to 3200Mbps.

• SDRAM (64Mb to 256Mb) @ 2.5V / 3.3V
• DDR (64Mb to 256Mb) @2.5V
• DDR2 (128Mb to 2Gb) @ 1.8V
• DDR3 (1Gb to 8Gb) @ 1.5V / 1.35V
• DDR4 (4Gb) @ 1.2V

Features

• Sequential or Interleave burst
• High Clock rate
• Standard Self Refresh
• Partial-Array Self Refresh (PASR
• Automatic Temperature Compensated Self Refresh Rate(ATCSR)
• Deep Power-Down (DPD)
• Programmable output buffer driver strength

LPSDR and LPDDR support x16 and x32 data width. HYPERRAM™ x8 or 16x dependent on its memory density and PSRAM x16. Ask for KGD options.

For Industrial and Automotive

SDR, DDR, DDR2, and DDR3 support certificates

• AEC-Q100
• TS16949
• ISO9001/14001
• OHSAS18001

SDRAM is available with x16 and x32 data width, DDR up to DDR4 with x8 and x16. Winbond provides professional advices to KGD customers, including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test and more.

You need a robust memory solution for your next product? Don’t hesitate to get in contact with our team directly.