The Japanese DRAM IC manufacturer Zentel offers memory solutions in the SDRAM, DDR1, DDR2, DDR3 and DDR4 segments. The future roadmap also includes further investments in the area of DDR5 & LPDDR4. First products in the form of engineering samples are expected for this product area in Q2 & Q3 2022.
Here we would like to take a closer look at Zentel’s DDR3 solutions. The derivatives of the DDR3 product family use a technology with structure widths smaller than 30nm.
Products with memory densities from 1Gb up to 16Gb are available in mass production status for their series application. The devices are available in either FBGA-78 or FBGA-96 packages, in commercial grade -40°C +85°C, automotive grade 2 types are available with 1Gb, many more are currently being planned.
In addition, first engineering samples are expected to be available from Q3 2022 for 1Gb DRR3 with 1.35V / 1.5V and from Q2 2022 for 4Gb with “Built in ECC”, further DDR3 2Gb and 8Gb solutions with “Built-in ECC” are planned.
In addition to an attractive pricing policy for the storage solutions, their excellent availability of approx. 20 weeks for their series production is a key selection criterion.
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