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Product change notification

32-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25320A) Process Geometric Shrink andDevi
32-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25320A) Process Geometric Shrink andDevi
32-Kbit Two-wire interfaceAutomotive Grade Serial EEPROM (AT24C32A) Process Geometric Shrink an
8-Mbit Serial Flash (AT25DF081, 1.65V to 1.95V) Process Geometry Shrink and Discontinue 11-Ball
Addition of the X-FAB (Malaysia) Wafer Fabrication Facility for all AT45DB041D Products
Addition of the X-FAB (Malaysia) Wafer Fabrication Facility for All AT45DB321D Products
AT24C32D & AT24C64D Introduction of New Serial EEPROMs with an Operating Range of 1.7V to 5.5V
AT25128A, AT25256A Die Shrink & Remove PDIP Package Offering
AT25F512A Die and Design Shrink
AT26DF161 Die and Design Shrink
AT88SCxxyyC CryptoMemory Optimized Layout in PDIP & SOIC
AT91SAM7S256 MRL B Revision and Ordering Code Change
AT91SAM7S32 Revision and Ordering Code Change
AT91SAM7S64 Revision and Ordering Code Change
AT91SAM7S64 Revision and Ordering Code Change
ATmega2561 & ATmega2560 Transfer of Manufacturing Operations
Atmel Sale of Serial FlashProduct Family to Adesto Technologies
Change in Test Operation Locations for Select ATF15xx CPLD Family in Select Packages
Change to a New Assembly Subcontractor for the ATA5756
Change toa New Assembly Subcontractor for the T5754
EOL Leaded Versions of 5V Simple PLD ATF22V10xx & Migrate Customers to RoHS
Release of the ATA5830 ROM Firmware Version (v2.3)
Speed Increase for theAT32UC3A and AT32UCA3 Product Families
W3H32M64E-XSBX and W3H32M72E-XSBX
W3H32M64E-XSBX and W3H32M72E-XSBX datasheet change
1-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25010A) Product Layout Optimization andDev
128-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25128A) Process Geometric Shrink & Devic
128-Kbit Two-wire InterfaceAutomotive Grade Serial EEPROM (AT24C128) Process Geometric Shrink &
16-Kbit Two-wire interface Automotive Grade Serial EEPROM (AT24C16A) Process Geometric Shrink an
16-Mbit DataFlash® (AT45DB161D) Process G eometry Shrink and Device Enhancement
16-Mbit Serial Flash(AT25DF161) Process Geometry Shrink and Device Enhancement
2-Kbit SPI interface Automotive Grade Serial EEPROM (AT25020A) Product Layout Optimization and D
2-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25020A) Product Layout Optimization andDev
2-Kbit Two-wire Interface Industrial Temperature Grade (-40C to 85C) Serial EEPROM (AT24C02C)
2-Mbit DataFlash® (AT45DB0 21D) Process Geometry Shrink and Device Enhancement
2-Mbit DataFlash® (AT45DB021D) Process Geometry Shrink and Device Enhancement
2-Mbit DataFlash® (AT45DB021E) – Yield Improvement
256-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25256A) Process Geometric Shrink & Devic
256-Kbit Two-wire interfaceAutomotive Grade Serial EEPROM (AT24C256) Process Geometric Shrink &
2DID Branding Change
2DID Implementation
2DID Marking Update
2nd source qualification for ACT88325/ACT88326
4-Kbit 3-wireInterface Automotive Grade Serial EEPROM (AT93C56A/ AT93C66A) ProcessGeometric Shri
4-Kbit SPI interfaceAutomotive Grade Serial EEPROM (AT25040A) Product Layout Optimization andDev
5.0WVGA Panel Change Notice
5.0WVGA Panel Change Notice
64-Kbit SPI InterfaceAutomotive Grade Serial EEPROM (AT25640A) Process Geometric Shrink andDevic
A29xxx series. 5V 1M/4M/8M/16Mbits NOR Flash
ACT8865QI305-T OSAT Change
Add 2nd assembly and FT source for PPM
Add 2nd assembly source for PPM
Add 2nd source Lead frame for PAC
Add a 6-bit Code on Labels of all Modules to Indicates its Operating Temperature and Flash Size
Add a new Assembly and Test Manufacturing (ATM) plant for ESP32-D0WD and ESP32-S0WD
Add a new Assembly and Test Manufacturing (ATM) plant for ESP8285 Series of Chips
Add AIC Malaysia as a Second Source for RF Tag Products Assembly a. Test Location; AT88RF416-MSA
Add AIC Malaysia as a Second Source for RF Tag Products Assembly and Test Location; AT88RF319
Add Alternative 8 MB Flash Source for ESP32 Series of Modules
Add Alternative 8 MB Flash Source for ESP32-S2 Series of Modules
Add Alternative 8MB/16 MB Flash Source for ESP32 Series of Modules
Add AS for 40L PDIP for the Microcontroller, EPROM & EPLD Products
Add ASE Shanghai, China for Industrial Grade Serial EE 8ld JEDEC TSSOP Package; AT24C
Add ASECL as new assembly site for LQFP package products
Add ASECL as new assembly site for LQFP package products.
Add Assembly & Test Sources for ESP8266EX
Add Atmel Colorado Springs as Second Wafer Fab Source for AT75k Technology Referring to Antenna
Add ATmel Colorado Springs Wafer Fab Facility for ATA6836
Add ATMEL Colorado Wafer Fab to Manufacture ATmega16A, Atmega32A
Add ATMEL Rousset (FR) for Selected AVR Product Manufacturing; ATmega8/32/48/88/168
Add ATP (Amkor Philippines) for the AT90PWM81and AT90PWM161 SOIC 20L Final Test Location
Add automatic test equipment(ATE) platform of final test(FT) for I941xxxDI series products
Add Copper Bonding Wire Capability for the AT91SAM9Gxxx Devices
Add Copper Bonding WireCapability AT91SAM9* ARM Microcontrollers
Add Greatek as new testing site for NAU8814YG product
Add JCET as 2nd source of some PPM products
Add JCET as 2nd source of some PPM products
Add NittoEM-350 as the alternative DAF material for ESP32-PICO-D4
Add Product Code for QM11022U and QM12630
Add Qualified Subcon for 28QFN 4×4 MCU Assembly & Test, ATMEGA48
Add SMIC as new fabrication site_NAU88C22 & NAU88C1x series
Add TFME as new assembly and testing site for N76E003AT20 product
Add TSMC (Taiwan) Wafer Fabrication Facility, AT91R40008, AT91RM9200 and AT91SAM9260 Products
Add UMC Foundry (Taiwan) as the Second Wafer Fab Source for the AT32UC3A0512 Automotive
Add UTAC, Thailand for theUC3L Devices Final Test Location
Adding a Second Fabrication Plant for Espressif Modules
Adding alternate source for wafer bumping
Adding an QR code to the shielding case of ESP-WROOM-02/ESP32-WROOM-32/ESP32-WROVER
Adding Copper Bonding Wire Capability for Selected ARM Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Microchip Technology Thailand (MMT) as a New Assembly Site for ProASIC3 and IGLOO Devices in VQ100 and VQG100 Packages
Addition of a SOT-89 Assembly CM
Addition of a SOT-89 Assembly CM
Addition of a SOT-89 Assembly CM
Addition of a SOT-89 Assembly CM
Addition of Amkor Technology(China) as a Qualified Subcontractor
Addition of ASE Korea as a Supplier, ATTINY13, ATTINY23, ATTINY24, ATTINY25, ATTINY43, ATTINY44,
Addition of ASE, Shanghai for Serial Flash 8L SOIC 150 mil Package Assembly and Test; AT25,AT45
Addition of ASECL (ChungLi-Taiwan) for Final Test of maXTouch Touchscreen Controllers in the QFN
Addition of ASET as test facility for SAMR21E18, SAMR21E19
Addition of Atmel Colorado Springs, CO Wafer Fab Location for the Frac-N RF Transmitter IC ATA57
Addition of ATP (Amkor Philippines) Final Test Location for Amsterdam AT32UC3A0 and AT32UC3A1
Addition of ATP (Amkor Philippines) Final Test Location for Amsterdam AT32UC3A0 and AT32UC3A1
Addition of Semiconductor Manufacturing International Corporation
Addition of Semiconductor Manufacturing International Corporation for AVR MCU Products
Addition of SMIC (China) Wafer Fabrication Facility for Selected AVR Product Manufacturing
Addition of SMIC WaferFabrication Facility for Selected AVR Product Manufacturing
Addition of SMIC WaferFabrication Facility for Selected AVR Product Manufacturing
Addition of SOT-89 Assembly CM
Addition of SOT-89 Assembly CM
Addition of the UMC (Taiwan) Wafer Fabrication Facility for all AT25DF321A Products
Addition of the X-FAB (Malaysia) Wafer Fab Facility for all AT45DB011D Products
Addition of the X-FAB (Malaysia) Wafer Fabrication Facility for All AT25F512B Products
Addition of the X-FAB (Malaysia) Wafer Fabrication Facility for all AT45DB011D Products
Addition of TSMC Wafer Manufacturing Facility for maXTouch Touchscreen Controllers ATMXT
Addition of UMC Wafer Manufacturing Facility for AVR32 Microcontrollers
Addition of UMC Wafer Manufacturing Facility for AVR32 Microcontrollers Controllers
Addition of UTAC (UTL3Thailand) Final Test Location for ATTinyx5 20QFN Product Family
Addition of UTAC Thailand for the ATMEGA16U4 & ATMEGA32U4 44 QFN Final Test Location
Additional reel dimension for TCXO 2016/2520size
Adesto® Products – Wafer Probe Test Site
Adesto® Serial Flash & DataFlash® Products Package Marking Change
All tape products need to be packaged in aluminum foil bags with MSL3 signs
Alternate Assembly, Test, T&R
Alternate Assembly, Test, T&R Site
Alternate Bump, Test and DPS Sites
Alternate Foundry
Alternate Foundry
Alternate Foundry and Laminate
Alternate Foundry for QM56028 and QM56030 GaAs Die
Alternate Foundry Notification
Alternate Foundry Notification
Alternate GaAs Fab
Alternate Laminate Substrate Supplier (Revised)
Alternate source for wafer bumping
Alternate source for wafer bumping
Alternate source for wafer bumping
Alternate Substrate Supplier
Announcement of cell surface material change for CR1225 tabbed batteries
APM TO263 Lead frame Manufacturing Site Change
Assembly Location and Lead-Free Material Changes for CryptoMemory AT88SCxxyyC-SU / AT88SCxxxyyCA
Assembly Site Change
Assembly SubcontractorLocation Change for the ATA6829-T3QY 71 (Package PSO16; exposed pad)
AT Bin Version Upgrade For ESP8266 Modules
AT24C01C to AT24C01D — 1-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
AT24C04C to AT24C04D — 4-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
AT24C08C to AT24C08D — 8-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature
AT24C128B Introduction of New 128K Serial EEPROM
AT24C16B Introduction of New 16K Serial EEPROM
AT24C16C to AT24C16D — 16-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature Grade (-40°C to 85°C) Serial EEPROM Process Optimization and Device Enhancement
AT24C256B OPTIMIZED LAYOUT AND LOW-VOLTAGE
AT24C32D & AT24C64D Introduction of New 1.7V 32K and 64K Serial EEPROMs
AT24C32D to AT24C32E — 32-Kbit I2C-Compatible (Two Wire Interface) Industrial Temperature Grade (-40°C to 85°C) Serial EEPROM Process Optimization and Device Enhancement (Continued Support of 5V 1-Kbit Two-Wire Interface Industrial Temperature Grade (-40 to 85C) EEPROM device (AT24C32D))
AT25010A, AT25020A and AT25040A DIE SHRINK
AT25010A, AT25020A and AT25040A Optimized Layout
AT25080A and AT25160A Die Shrink
AT25080A and AT25160A Die Shrink
AT25080A and AT25160A DIE SHRINK
AT25080A and AT25160A Die Shrink & Remove PDIP Package Offering
AT25080A, AT25160A Die Shrink & Remove PDIP Package Offering
AT25128A and AT25256A Die Shrink
AT25320A and AT25640A Die Shrink
AT25F2048 Die and Design Shrink
AT25F512A Die and Design Shrink
AT26DF081A End-of-Life (EOL) Notice
AT26DF161A Design Shrink
AT26DF321 and AT25DF321 Migration to 110nm Process Node
AT32UC3A0512 Design Fix
AT88SCxxyyC CryptoMemory Optimized Layout in PDIP & SOIC Packages
AT89LP51 and AT89LP52 8-bit MCU Design Revision-C
AT91SAM7S128 MRL B Revision and Ordering Code Change
AT91SAM7S512 MRL B Revision and Ordering Code Change, Adding UMC Manufacturing Location
AT91SAM7S64 MRLB Revision, Ordering Code and Manufacturing Location Change
AT91SAM7X Revision and Ordering Code Change
AT91SAM7XC128 and AT91SAM7XC256 Revision and Ordering Code Chang
AT91SAM9260 DATASHEETSUPDATE
AT91SAM9261 Revision and Ordering Code Change
AT91SAM9G20 Revision and Ordering Code Change
AT93C46 Automotive Product Layout Optimization & Conversion
ATA2526PxxxC VIA Layer Change and Transfer Wafer Fab Location
ATA2526PxxxH VIA Layer Change & Transfer Wafer Fab Location
ATA5577M1330C-PAE Change of NOA3 to NOA3S Package
ATA5721_ATA5722 Wafer FabTransfer to Atmel Colorado Springs and EOL of the TSG Product Version
ATA5723P3-TKQY Wafer FabTransfer to Atmel Colorado Springs
ATA5724P3 Wafer Fab Transferto Atmel Colorado Springs
ATA5745_ATA5746 Wafer FabTransfer to Atmel Colorado Springs
ATA5749 Wafer Fab Transferto Atmel Colorado Springs and EOL TSG Product Version
ATA5756* andATA5757* Wafer Fab Transfer to Atmel Colorado Springs and EOL of the TSGProduct Vers
ATA5773-PXQW Wafer Fab Transfer to Atmel Colorado Springs and EOL of the TSG Product Version
ATA5774-PXQW Wafer FabTransfer to Atmel Colorado Springs and EOL of the TSG Product Version
ATA5811*, ATA5812* Wafer FabTransfer to Atmel Colorado Springs and EOL of the TSG Product Versio
ATA6624C Additional Assembly Location
ATA663231/54/03 ATA663431/54
ATA663231/54/03 ATA663431/54
ATA6663-FAQW Additional Assembly Location
ATA6670-FFQW Additional Assembly Location
ATA6824-MFHW Wafer FabTransfer to Atmel Colorado Springs and EOL of the TSG Product Version
ATA6826-TUQY Add CSO Wafer Fab
ATA6833_ATA6834 Wafer FabTransfer to Atmel Colorado Springs
ATmega128 Test Limit Change
ATmega128 & ATmega128L Test Limit Change
ATmega16HVB and ATmega32HVBRevision Change from Revision B to Revision E
ATmega2561 Transfer of Manufacturing Operations
ATmega406 Production Test at ASE Taiwan
ATmega8 Test Limit Change
Atmel Colorado Springs as Second Wafer Fab Source for AT75k Technology ATA6824-MFHW
ATMXT224 Firmware Revision Change from V1.5 to V1.6
ATMXT224 Firmware Revision Change from V1.6 to V2.0
ATMXT640T FIRMWARE UPDATE FROM v1.6.AA TO v1.7.AA
ATMXT641T FIRMWARE UPDATE FROM v1.6.AA TO v1.7.AA
ATR0610-PQQ Change ofAssembly Location Due to Thailand Flood
ATR1841-P1QW – Datasheet Updated After Product Characterization
ATR4251_ATR4253 Wafer FabTransfer to Colorado Springs
ATR4252-RAQW Wafer FabTransfer to Atmel Colorado Springs
ATSHA204 Copper (CU) Bond Wire Change
ATSHA204 UDFN (MAH) Assembly/Test Second Source
ATxmega Microcontroller Final Test Transfer to ASE Kaohsiung-Taiwan and ASE-Korea
ATxmega Microcontroller Final Test Transfer to ASE Kaohsiung-Taiwan and ASE-Korea
ATxmega Microcontroller Final Test Transfer to ASE Kaohsiung-Taiwan and ASE-Korea
Automotive ATMEGA164P, ATMEGA324P, ATMEGA644P ADC Upgrade
Automotive ATMEGA164P, ATMEGA324P, ATMEGA644P ADC Upgrade
Automotive ATtiny87 ATtiny167 with LIN2.1 Slave Mode Break Field Detection Correction
AVR MCU Product Change from Gold to Copper Bonding Wire
AVR Microcontroller Design Revision
AVR Microcontroller Design Revision
Battery Holder NH5077-LF
Battery Holder NL5077-LF
BAW filter die update
BL12864G metal frame change
BOM Change for ESP32-C3-WROOM-02U
BOM Change for Several ESP8685-Based Modules
Bringing up Vanguard as second source wafer fab to improve CODEC supply for DA7217 and DA7218
Build up a new 2nd assembly source site in Korea (STS) forTSOP48 6304 & 6305 products
Burn In Product Transfer
Burn-in time reduction 8H->4H
C51 0.5µ ROMless/ROM/OTP EOL / AT80C, TS80C, AT83C, AT87C
Cancellation Notice: EOL of AT28 Series Parallel EEPROM (256k and 1Mb) Military grade devices in the CerDIP packages only.
Capacity Expansion for the .150″ Narrow SOIC Package
Capacity Expansion for the .150″ Narrow SOIC Package and .208″ Wide SOIC Package
CCB 1737.10 Final Notice: Release to production of listed Micrel Regulator product type manufactured with the CSI05 process technology to Microchip Fab.
CCB 2695.009 Final Notice: Qualification of ANAC as an additional assembly site for selected KSZ9131RNXxx and KSZ9031RNXxx device families available in 48L VQFN (7x7x0.9 mm) package.
CCB 2927.001 and CCB 3280.002 Final Notice: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xC, AT24C128C, AT24C16C, AT24C256C, AT24C32D and AT24C64D device families available in 8L SOIC package.
CCB 3265.001 Final Notice: Qualification of UMC Fab 8N (U08N) as an additional fabrication site for various Atmel catalog part numbers.
CCB 3265.001 Final Notice: Qualification of UMC Fab 8N (U08N) as an additional fabrication site for various Atmel catalog part numbers.
CCB 3296.003 Final Notice: Qualification of gold (Au) bond wire for selected Atmel ATTINY88xx, ATTINY48xx, ATMEGA88PAxx, ATMEGA168PAx, ATMEGA8Axx, ATMEGA328x and ATMEGA48xx device families available in 32L TQFP (7x7x1mm) package
CCB 3363.002 Final Notice: Qualification of UNIS as a new final test site for selected Atmel 24CW64xxx device family available in 4L WLCSP package.
CCB 3379.002 and CCB 3280.001 Final Notice: Qualification of MTAI as an additional assembly and final test site for selected Atmel AT24C0xD, AT24C16D and AT24C32E device families available in 8L SOIC packages.
CCB 3459.002 Final Notice: Qualification of MTAI as an additional assembly site for selected Micrel automotive products available in 32L VQFN (5x5x0.9mm) package.
CCB 3546.001 Final Notice: Qualification of MTAI as an additional final test site for selected Atmel ATTINY414 device family available in 14L SOIC package.
CCB 3546.002 Final Notice: Qualification of MTAI as an additional final test site for Atmel ATTiny414-SSF and ATTiny414-SSFR catalog part numbers (CPN) available in 14L SOIC package.
CCB 3640 Final Notice: Qualification of MTAI as a new final test site for selected Atmel products available in 20L PLCC package.
CCB 3640.003 Final Notice: Qualification MTAI as a new final test site for AT89C5131A-S3SUL Atmel catalog part number (CPN) available in 52L PLCC (19.1×19.1×4.4mm) package.
CCB 3737 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected Atmel products available in 48L VQFN package at ASCL assembly site.
CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.
CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.
CCB 3762 Final Notice: Qualification of MMT as an additional assembly site for ATA5291x device family available in 48L VQFN (7x7x1mm) package.
CCB 3781.001 Final Notice: Qualification of an additional bill of material for T061NHEI and WP3061WxNHEI Microsemi device families available in 528L HBFBGA (19x19x2.71mm) package at ASE assembly site.
CCB 3788.002 Final Notice: Qualification of Lintec backside coating (BSC) material for selected Micrel MIC2782xxx device family available in 6L WLCSP (1.2×0.8×0.63mm) package at UAT assembly site.
CCB 3792 Final Notice: Qualification of MMT as an additional assembly site for Atmel ATA5279C-WGQW catalog part number (CPN) available in 48L VQFN (7x7x1mm) package.
CCB 3979 and 3979.001 Final Notice: Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly site.
CCB 4031 Final Notice: Qualification of Microchip Technology Tempe – Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.
CCB 4041.002 Final Notice: Qualification of MTAI as an additional assembly site for selected Atmel ATMXT224Sxx, ATMXT336Sxx and ATXMEGA64D3xx device families available in 64L TQFP (10x10x1mm) package.
CCB 4082.007 Final Notice: Qualification of MTAI as a new final test site for selected Microsemi products available in 48L LQFP (7x7x1.4mm) package.
CCB 4086 and 4086.001 Final Notice: Qualification of MMT as an additional assembly site for ATA663xx, ATA656xx, ATA662xx and ATA657xx device families available in 8L VDFN (3.0×3.0x1.0mm) and 14L VDFN (3.0×4.5×0.9 mm) packages.
CCB 4108 Final Notice: Qualification of DEI6 as a new assembly site for selected ATML ATWILC3000 and ATWINC3400 device families available in 36L Module package.
CCB 4121 Final Notice: Qualification of HR-5104 die attach material for Micrel DSA1121WA1-100.0000VAO catalog part number (CPN) available in 6L VDFN (3.2×2.5×0.9mm) package at NSEB assembly site.
CCB 4154.001 Final Notice: Qualification of MMT as an additional assembly site for SST25VF080B-50-4C-PAE catalog part number (CPN) available in 8L PDIP package.
CCB 4159 Final Notice: Implement Microchip Part Aging Policy, Recertification and Combination rules, Labels and Packing Changes for selected Microsemi Field Programmable Gate Array (FPGA) and Mixed Signal and ASIC(MSA) products
CCB 4173 Final Notice: Qualification of NSEB as a new assembly site for selected MD010xxx device families available in 18L VDFN (5x5x1.0mm) package.
CCB 4179 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA663454 and ATA663431 device families available in 16L VDFN (3×5.5x1mm) package.
CCB 4179 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA663454 and ATA663431 device families available in 16L VDFN (3×5.5x1mm) package.
CCB 4179 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA663454 and ATA663431 device families available in 16L VDFN (3×5.5x1mm) package.
CCB 4198.001 Final Notice: Qualification of ASSH as a new assembly site for selected 24xx01, 24xx02, 24xx04, 24xx08 and 24xx16 device families available in 8L TSSOP package.
CCB 4198.002 Final Notice: Qualification of ASSH as a new assembly site for selected 25AA640xx and 25LC640xx device families of 36K wafer technology available in 8L TSSOP package.
CCB 4204 Final Notice: Qualification of Microchip Technology Tempe – Fab 2 (TMGR) as a new fabrication site for selected Microsemi SG1524BN, SG2524Bxx and SG3524Bxx device families available in 16L PDIP (.300in) and 16L SOIC (.300in) packages.
CCB 4214.001 Final Notice: Qualification of MMT as a new assembly site for selected MSCC LX3302Axxx and LX34050xxx device families available in 14L TSSOP (4.4mm) package.
CCB 4222 Final Notice: Qualification of NSEB as a new assembly site for STEX HV7355K6-G catalog part number (CPN) available in 56L VQFN (8x8x1.0mm) package.
CCB 4239 Final Notice: Qualification of NSEB as a new assembly site for HV892K7-G catalog part number (CPN) available in 10L WDFN (4x4x0.8mm) package.
CCB 4245 Final Notice: Qualification of MMT as an additional assembly site for selected Atmel ATA57xx, ATA58xx, ATA82xx and ATA85xx device families available in 32L VQFN (5x5x1mm) package using palladium coated copper with gold flash (CuPdAu) bond wire
CCB 4270 Final Notice: Qualification of GTK as a new assembly site for selected Atmel products available in 28L SOIC (.300in) package.
CCB 4270 Final Notice: Qualification of GTK as a new assembly site for selected Atmel products available in 28L SOIC (.300in) package.
CCB 4271 Final Notice: Qualification of GTK as a new assembly site for selected AT28BV64Bxx, AT28C64Bxx and AT28HC64Bxx Atmel device families available in 28L SOIC (300mils) package.
CCB 4279.001 Initial Notice: Qualification of GTK as a new assembly site for selected SST38VF640xx, SST39LF40xx and SST39VF40xx device families available in 48L TSOP (12x20mm) package.
CCB 4279.002 Initial Notice: Qualification of GTK as a new assembly site for selected SST39VF3201xx and SST39VF3202xx device families available in 48L TSOP (12x20mm) package.
CCB 4284 Final Notice: Qualification of GTK as a new assembly site for selected SST39VF640xxx and SST39VF320xxx device families available in 48L TSOP (12x20mm) package.
CCB 4284 Initial Notice: Qualification of GTK as a new assembly site for selected SST39VF640xxx and SST39VF320xxx device families available in 48L TSOP (12x20mm) package.
CCB 4294 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire and QMI-536 die attach material for a multi-die IS1678xx device family available in 40L VQFN (6x6x0.9mm) package.
CCB 4318 Final Notice: Qualification of ASCL as an additional assembly site for selected products available in 100L VQFN (12X12X0.9mm) package.
CCB 4318 Final Notice: Qualification of ASCL as an additional assembly site for selected products available in 100L VQFN (12X12X0.9mm) package.
CCB 4318 Final Notice: Qualification of ASCL as an additional assembly site for selected products available in 100L VQFN (12X12X0.9mm) package.
CCB 4345 Final Notice: Qualification of MTAI as a new assembly site for selected Supertex products available in 16L QFN (4x4mm) package.
CCB 4347.001 Final Notice: Implement new packing material (JEDEC tray) and packing changes for selected RN41Nxxx module.
CCB 4381 Initial Notice: Qualification of MTAI as an additional final test site for selected Atmel ATSAMD20E1xA device family available in 32L TQFP (7x7x1.0 mm) package.
CCB 4384.001 Final Notice: Qualification of MMT as an additional assembly site for IS1678S-151, IS1678S-151-TRAY, IS1678S-152, and IS1678S-152-TRAY catalog part numbers available in 40L VQFN (6x6x0.9mm) package.
CCB 4395 Final Notice: Qualification of MMT as an additional assembly site for selected Micrel products available in 16L VQFN (3x3x1.00mm) package.
CCB 4395 Initial Notice: Qualification of MMT as an additional assembly site for selected Micrel products available in 16L VQFN (3x3x1.00mm) package.
CCB 4397 Final Notice: Qualification of MTAI as a new assembly site for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 8L SOIC (3.90mm) package.
CCB 4397 Final Notice: Qualification of MTAI as a new assembly site for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 8L SOIC (3.90mm) package.
CCB 4397 Final Notice: Qualification of MTAI as a new assembly site for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 8L SOIC (3.90mm) package.
CCB 4404 Initial Notice: Qualification of ASSH as a new assembly site for 24LC512, 24AA512 and 24FC512 device families available in 8L TSSOP package.
CCB 4420 Final Notice: Implement new carrier tape width (24mm) for Atmel ATSAM4C32CA-AUR catalog part number (CPN) available in 100L LQFP (14x14x1.4mm) package tested at ASE9 and MPHL final test site.
CCB 4423 Final Notice: Qualification of MPHL as an additional final test site for Atmel ATSAMC21Nxxx and ATSAMC20Nxxx device families available in 100L TQFP (14x14x1mm) package.
CCB 4427 Initial Notice: Qualification of NSEB as a new assembly site for selected Atmel ATXMEGA device family available in 64L (9x9x1mm) VQFN package.
CCB 4433.001 Initial Notice: Qualification of ATK as an additional assembly site for Atmel ATSAM2613LC-CUR-101 catalog part number (CPN) available in 289L LFBGA (14X14X1.4mm) package
CCB 4439 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L DFN (4x4x0.9mm) package at MMT assembly site
CCB 4439.001 and 4439.002 Final Notice: Qualification of MMT as an additional assembly site for selected products available 8L DFN (3x3x0.9mm) and (2x3x0.9mm) packages.
CCB 4440 Final Notice: Qualification of MMT as an additional assembly site for selected MTCH112, MTCH810 and PIC12xxxx device families available in 8L DFN (3x3x0.9mm) package.
CCB 4441 Final Notice: Qualification of Elite Semiconductor Microelectronics Technology (ESMT12) as a new fabrication site for Die #2 of a multi-die IS1678xx device family available in 40L VQFN (6x6x0.9mm) package.
CCB 4441 Final Notice: Qualification of Elite Semiconductor Microelectronics Technology (ESMT12) as a new fabrication site for Die #2 of a multi-die IS1678xx device family available in 40L VQFN (6x6x0.9mm) package.
CCB 4442.001 Initial Notice: Qualification of G631HQ mold compound material for Atmel AT8USDX6CDR-RUTU and AT8UA1184AE5-RUTU catalog part numbers (CPN) available in 144L LQFP (20x20x1.4mm) package.
CCB 4463 Initial Notice: Qualification of MPHL as a new final test site for selected Atmel AT8300xxx, AT8356xxx, AT40Kxxx, AT8357xxx, AT8358xxx, AT8359xxx, AT82000xxx, and AT82002xxx device families available in various packages.
CCB 4470 Final Notice: Implement new carrier tape and reel for selected Atmel products available in 64L TQFP (14x14x1.0mm) package at ASE9 final test site.
CCB 4477 Final Notice Implement additional cover tape, carrier tape and plastic reel material supplier for selected Micrel products available in 3L, 5L, 6L and 8L SOT23, 5L and 6L TSOP and 8L SOIC packages at STAR assembly site.
CCB 4477 Final Notice Implement additional cover tape, carrier tape and plastic reel material supplier for selected Micrel products available in 3L, 5L, 6L and 8L SOT23, 5L and 6L TSOP and 8L SOIC packages at STAR assembly site.
CCB 4479 Initial Notice: Qualification of NSEB as a new assembly site for selected Micrel PL123xx, PL133xx, PL135xx, PL610xx and PL611xx device families available in 6L UDFN (1.3×2.0x0.6mm) package.
CCB 4490 Initial Notice: Qualification of MTAI as an additional final test site for selected Atmel ATSAMC21Nxxx and ATSAMC20Nxxx device families available in 100L TQFP (14x14x1mm) package.
CCB 4492 Initial Notice: Qualification of NSEB as a new assembly site for selected Atmel products available in 28L VQFN (4X4X1mm) package with MSL 1 classification.
CCB 4493 Initial Notice: Qualification of NSEB as a new assembly site for selected Atmel ATMEGA328x device family available in 28L VQFN (4X4X1mm) package with MSL 1 classification.
CCB 4495 Final Notice: Qualification of MTAI as a new assembly site for selected MCP25625 device family available in 28L QFN (6.0X6.0X0.9mm) package.
CCB 4495 Initial Notice: Qualification of MTAI as a new assembly site for selected MCP25625 device family available in 28L QFN (6.0X6.0X0.9mm) package.
CCB 4502 Initial Notice: Qualification of NSEB as a new assembly site for ATTINY43x, ATTINYx4x, ATTINYx313x, ATTINY84x, ATTINY1634x, ATTINY44x, ATTINY13x, ATTINY85x, AT73C508, ATTINY45x, ATTINY25x and QT14C10 device families available in 20L WQFN (4X4X0.8mm) package.
CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.
CCB 4506 Initial Notice: Qualification of MMT as an additional assembly site for selected products available in 8L TDFN (2x3x0.8mm) package.
CCB 4507 Initial Notice: Qualification of MMT as an additional assembly site for selected products of MCP9844T and MCP98244T device family available in 8L TDFN (2x3x0.8mm ) package.
CCB 4508 Initial Notice: Qualification of NSEB as a new assembly site for selected ATTINY20, ATTINY40, AT42QT2120, AT42QT1070, AT42QT1050 device families available in 20L VQFN (3x3x0.85mm) package.
CCB 4509 Initial Notice: Qualification of NSEB as a new assembly site for selected ATTINY2xx, ATTINY44x, ATTINY84x and AT42QT1040 device families available in 20L VQFN (3X3X0.85mm) package
CCB 4510 Final Notice: Implement Microchip Part Aging Policy, Tape and Reel Combination rules, Label and Packing Changes for selected Microsemi High Reliability Discrete Solutions (HRDS) products
CCB 4511 Initial Notice: Qualification of ATK and STAR as a new assembly site and ATK as a new final test site for Microsemi PAS6413A-F3GC catalog part number (CPN) available in 170L FBGA (10x10x2.25mm) package.
CCB 4514 Initial Notice: Qualification of MTAI as an additional assembly site for selected MSCC products available in 48L VQFN (7x7x1mm) package.
CCB 4514.001 Final Notice: Qualification of MTAI as an additional assembly site for selected LE96xxx device family available in 36L VQFN (4x6x1mm) package.
CCB 4523 and 4523.001 Initial Notice: Qualification of MTAI as an additional assembly site for selected ATSAMC20xx, ATSAMC21xx, ATSAMD20xx, ATSAMD21xx and ATSAMDA1xx device families available in 48L VQFN packages.
CCB 4526 Initial Notice: Qualification of a new fabrication site (Microchip – Fab 5) for various Microsemi products.
CCB 4527 Initial Notice: Qualification of ASE as an additional assembly site for selected PM40xxx, PM41xxx and PM42xxx Microsemi device families available in 1467L BBGA (40x40x4.03mm) package.
CCB 4528 Initial Notice: Qualification of MTAI as an additional assembly site for selected ATMEGA809, ATMEGA1609, ATMEGA3209 and ATMEGA4809 Atmel device families available in 48L VQFN (6x6x0.9mm) package.
CCB 4530 Initial Notice: Qualification of MMT as an additional assembly site for selected ATA6617C-P3QW-1 and ATA6616C-P3QW-1 catalog part numbers (CPNs) available in 38L VQFN (5x7x1mm) package.
CCB 4532 Final Notice: Implement Microchip Top marking changes for selected Microsemi Field-Programmable Gate Arrays (FPGAs) products available in various packages.
CCB 4533 Initial Notice: Qualification of MMT as a new assembly site for selected IS1677SM device family available in 40L VQFN (6x6x0.9mm) package using die #2 fabricated at Elite Semiconductor Microelectronics Technology (ESMT12) fab site.
CCB 4534 Final Notice: Implement Microchip marking changes for selected Microsemi MSA products available in various packages.
CCB 4539 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.
CCB 4540 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.
CCB 4541 Final Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.
CCB 4541 Final Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and gold (Au) bond wire material assembled at MMT assembly site.
CCB 4542 Initial Notice: Qualification of a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and gold (Au) bond wire material assembled at MMT assembly site.
CCB 4547 Initial Notice: Qualification of palladium coated copper (PdCu) bond wire for selected 24AA512, 24FC512 and 24LC512 device families available in 8L TSSOP package assembled at ANAP assembly site
CCB 4550 and 4550.001 Initial Notice: Qualification of STAR as an additional assembly site for selected Micrel products available in 4L VDFN (3.2x 2.5 x 0.9 mm) and (2.0 x2.5 x0.9 mm) packages.
CCB 4552.001 Initial Notice: Qualification of ATK as an additional assembly site for PM5336B-FEI and PM5334A-FEI catalog part numbers (CPN) available in 1152L BBGA (35x35x3.32 mm) package.
CCB 4553 Initial Notice: Qualification of ATK as an additional assembly site for selected Microsemi products available in 896L BBGA (31x31x3.32 mm) package.
CCB 4556 Initial Notice: Qualification of SIGN as a new assembly site for selected SST39V320xx and SST38VF640xx device families available in 48L TSOP (12x20mm) package.
CCB 4557 Initial Notice: Qualification of MTAI as a new final test site for selected IS1677SM device family available in 40L VQFN (6x6x0.9mm) package
CCB 4559 Initial Notice: Qualification of SIGN as a new assembly site for selected SST39LFxxxx and SST39VFxxxx device families available in 48L TSOP (12x20mm) package.
CCB 4560 Initial Notice: Qualification of SIGN as a new assembly site for selected SST39LF80xx, SST39VF160xx and SST39VF80xx device families available in 48L TSOP (12x20mm) package.
CCB 4562 Initial Notice: Qualification of a new bill of materials (BOM) for selected PIC18Fxxx and PIC16Fxxx device families available in 128L LQFP (14x14x1.4mm) package at ANAP assembly site.
CCB 4564 Initial Notice: Qualification of ATK as an additional final test site for Microsemi PM8596B-FEI and PM8597B-FEI catalog part numbers (CPN) available in 436L HBFBGA (17x17x2.87mm) package.
CCB 4568 Initial Notice: Qualification of SIGH as an additional final test site for selected KSZ9031RNxx, MEC1515H and USB72xx device families available in 48L VQFN, 100L VQFN and 132L DQFN packages
CCB 4568 Initial Notice: Qualification of SIGH as an additional final test site for selected KSZ9031RNxx, MEC1515H and USB72xx device families available in 48L VQFN, 100L VQFN and 132L DQFN packages
CCB 4568 Initial Notice: Qualification of SIGH as an additional final test site for selected KSZ9031RNxx, MEC1515H and USB72xx device families available in 48L VQFN, 100L VQFN and 132L DQFN packages
CCB 4569 Final Notice: Qualification of MMT as an additional assembly site for ATA6663-FAQWxx device family available in 8L VDFN (3x3x1.0mm) package.
CCB 4569 Final Notice: Qualification of MMT as an additional assembly site for ATA6663-FAQWxx device family available in 8L VQFN (3x3x1.0mm) package.
CCB 4574 Initial Notice: Qualification of ASEM as an additional assembly site for ATSAM4C32CA-AU and ATSAM4C32CA-AUR catalog part numbers (CPN) available in 100L LQFP (14x14x1.4mm) package.
CCB 4576 Initial Notice: Qualification of NSEB as an additional assembly site for selected MEC5107Kxxx device family available in 176L WFBGA (10x10x0.8mm) package.
CCB 4578 Final Notice: Standardization of Pin 1 Orientation in Tape and Reel packing media for selected ATSAMCxxExx and ATSAMRxxExx devices families available in 32L VFQN (5x5x1 mm) package.
CCB 4580 Final Notice: Removing GS logo from the products labels of selected PD-3504G/ACxxx, PD-9004G/AC and PD-9501G/48VDC devices.
CCB 4587 Final Notice: Implement top marking change for AT91SAM9XE512B-QU Atmel catalog part number (CPN) available in 208L PQFP (28x28x3.37mm) package.
CCB 4593 Initial Notice: Qualification of MMT as an additional assembly site for selected Microsemi PD69208T4ILQ, PD81101ILQ, PD69208MILQ, PD69204T4ILQ, and PD39208ILQ device families available in 56L VQFN (8x8x1.0mm) package.
CCB 4594 Initial Notice: Qualification of MMT as an additional assembly site for selected PIC12LF184x, PIC12F184xx, PIC12LF182x, PIC12F182xx, PIC12LF157x, PIC12F157xx, PIC16LF183x, PIC16F183xx, PIC16LF153x and PIC16LF153x device families available in 8L UDFN (3x3x0.5mm) package.
CCB 4594 Initial Notice: Qualification of MMT as an additional assembly site for selected PIC12LF184x, PIC12F184xx, PIC12LF182x, PIC12F182xx, PIC12LF157x, PIC12F157xx, PIC16LF183x, PIC16F183xx, PIC16LF153x and PIC16LF153x device families available in 8L UDFN (3x3x0.5mm) package.
CCB 4611 Initial Notice: Qualification of MMT as an additional assembly site for selected Microsemi PD69101ILQ-TR and PD69101ILQ-13155TR catalog part numbers (CPN) available in 24L VQFN (4x5x1.0mm) package.
Centering of the Reference Voltage 4 Output (Parameter 1.4 in the datasheet)
Change Assembly and Test site for UWB modules
Change AssemblySubcontractor for the U2044B-MFPY and U2044B-MFPG3Y
Change Die Orientation on Sticky Tape of ATA5577M2330C-DBN
Change Embedded Flash Material on ESP32-C3FN4，ESP32-S2FN4R2，ESP32-S2FH4 and Related Module/ Develop Board Products
Change for ESP32-WROOM-32, ESP32-WROVER, ESP32-WROVER-I, and ESP-WROOM-02 modules
Change from Au bonding wires to Cu bonding wires
Change from Au bonding wires to Cu bonding wires
Change from conventional load board to FPGA load board at final test.
Change in the marking ofATPL210A-A1U-Y and ATPL220A-A1U-Y
Change Notice for Add Assembly Subcontractor -ASEKS (Assembly vendor code: K) for SOP8 (209mil)
change notification for ENS210 datasheet
Change of Assembly and Test site – QPD0005
Change of Assembly factory for QFP (Quat Flat Package)
Change of Bill of Material
change of bill of material for QFN
Change of Country of Origin For CR1216 MFR and CR1220 MFR naked cells
Change of Cover Tape Material from KOSTAT to ADVANTEK HUC for Use on 8mm Carrier
Change of final device test location to the current assembly house and consequently the final product label
Change of glass lid to metal lid for CX8V size parts
Change of Lead-free Product Part Number ATA5757
Change of MAC Address Series
Change of Packing Labels and Reel Size for Espressif Chip Products
Change of Packing Labels and Reel Size for Espressif Chip Products
Change of production site
Change Product Part Number due to Change on the Coding Matrix. Change from ACT8865QI303-T to
Change Product Part Number due to Change on the Coding Matrix. Change from ACT8945AQJ303-T to
Change product top marking of related products
Change Test & Ship Operation Location for ATF2500C CPLD MIL ONLY Product Family in Select Packag
Change to a New Assembly Subcontractor for the ATA5749C
Change to a New Assembly Subcontractor for the ATA5757
Change to a New Assembly Subcontractor for the T5750-6AQJ 71
Change to a New Assembly Subcontractor for the T5753-6AQJ 71
Change to a New Assembly Subcontractor for the T5754-6AQJ 71
Change to absolute maximum ratings and NTC functionality in the CCS811
Change to an Assembly Subcontractor ATA6826C-TUQY-66
Change to Atmel TSPIC/Philippines for the U3280M-NFBY / U3280M-NFBG3Y in SSO16 Package
Change to CM,Die attach, mold compound & MSL
Change to Die attach, mold compound & MSL
Change to Die attach, mold compound & MSL
Change to firmware application version to manage consistency of the eCO2 / TVOC readings during initial device operation and extend the output range
Change to mold compound for QPA4501
Change to package with Side casellations
Change toa New Assembly Subcontractor for the ATA5749C
Change toa New Assembly Subcontractor for the ATA5757
Change toa New Assembly Subcontractor for the T5753
Change toan Assembly Subcontractor ATA6826C-TUQY-66
Change UDFN Reel Quantity from 5K to 15K
Changes of the marking on ESP32-WROVER-E and ESP32-WROVER-IE to add new certification identification
Changeto a New Assembly Subcontractor for the ATA5756
Changeto a New Assembly Subcontractor for the T5750
Changing STI Process from ‘O3 TEOS’ to ‘HDP’
Chinese labeling on Timing Device products
CMD169/CMD169P4 Datasheet Correction
CMD170P4 Max Supply Current Typo Correction
CMD293 Design Change
CMD319C3 Datasheet Correction
CMD319C3 Datasheet Typo Correction
CMD328K3 Datasheet Spec Change
CMOS Die Transfer to Alternate Foundry
CMV2000 Test diode pads unbonding
CMV4000 Test diode pads unbonding
Coin cell Holder type NL5077-LF, NH5077-LF, NL5077-LFRS
Conversion to Cu Wire for SmartFusion, IGLOO2, and SmartFusion2
Conversion to RoHS-Compliant Fully Green Package for the TSSIO16E-TIRA
Convert Rating for 8 Lead SOIC from MSL2 to MSL1,AT25,AT26,AT45
Convert MSL3 to MSL1 for QFN Packages
Convert MSL3 to MSL1 for QFN Packages
Convert MSL3 to MSL1 for QFN Packages
Convert MSL3 to MSL1 for QFN Packages
Copper-Wire Bonding for QFN packages for AS3606x-BQFT / AS3607x-BQFT
Country of Origin Update for WLCSP
Country of Origin Update for WLCSP (QM81050)
CryptoMemory Copper (CU) Bond Wire Change
CryptoRF LV Capacitor Breakdown Fix, AT88SC
CryptoRF New Silicon Revision
CryptoRF New Silicon Revision
CryptoRF New Silicon Revision
CryptoRF New Silicon Revision and Changed MR1 Package
CryptoRF New Silicon Revision and Changed MR1 Package
CRYSTAL OSCILLATOR (2520 size) – Addition of manufacturing site
Data Sheet – 24AA01/24LC01B/24FC01 1K I2C Serial EEPROM Data Sheet
Data Sheet – 24AA02/24LC02B/24FC02 2K I2C Serial EEPROM Data Sheet Document Revision
Data Sheet – 24AA04/24LC04B/24FC04 4K I2C Serial EEPROM Data Sheet
Data Sheet – 24AA04H/24LC04BH/24FC04H 4K I2C Serial EEPROM with Half-Array Write-Protect
Data Sheet – 24AA08/24LC08B/24FC08 8K I2C Serial EEPROM Data Sheet Document Revision
Data Sheet – 24AA16/24LC16B/24FC16 Data Sheet Document Revision
Data Sheet – 24AA16H/24LC16BH/24FC16H 16K I2C Serial EERROM with Half-Array Write-Protect Data Sheet
Data Sheet – AT24C128C – I2C-Compatible (Two-Wire) Serial EEPROM 128-Kbit (16,384×8)
Data Sheet – AT24C32E – I2C-Compatible (2-Wire) Serial EEPROM 32-Kbit (4,096 x 8)
Data Sheet – AT24C32E – I2C-Compatible (2-Wire) Serial EEPROM 32-Kbit (4,096 x 8) Document Revision
Data Sheet – AT24C64D I2C-Compatible 2-Wire Serial EEPROM 64-Kbit (8,192×8) Data Sheet
Data Sheet – AT24CM02 I2C-Compatible (Two-Wire) Serial EEPROM 2-Mbit (262,144×8) Datasheet Document Revision
Data Sheet – AT24CM02 I2C-Compatible (Two-Wire) Serial EEPROM 2-Mbit (262,144×8) Document Revision
Data Sheet – AT28HC256 Industrial Grade 256-Kbit (32,768 x 8) High-Speed Parallel EEPROM Document Revision
Data Sheet – ATA6571 High-Speed CAN Transceiver Datasheet Document Revision
Data Sheet – ATA663201/ATA663203/ATA663231/ATA663254 Data Sheet Document Revision
Data Sheet – ATmega3208/3209 Data Sheet Document Revision
Data Sheet – ATmega4808/4809 Data Sheet Document Revision
Data Sheet – ATmega808/809/1608/1609 Data Sheet Document Revision
Data Sheet – ATMX150RHA Datasheet Document Revision
Data Sheet – ATtiny24A/44A/84A – Complete Datasheet
Data Sheet – ATTPM20P Trusted Platform Module (TPM) 2.0 – SPI Interface Summary Data Sheet
Data Sheet – ATWINC3400 IEEE 802.11 b/g/n Network Controller Module with Integrated Bluetooth
Data Sheet – BM78 Bluetooth Dual-Mode Data Sheet
Data Sheet – CEC1702 Automotive – Data Sheet
Data Sheet – DSA1101/21/05/25 Data Sheet
Data Sheet – DSA12x2/3/4 – High Performance Differential MEMS Oscillators for Automotive
Data Sheet – DSA12x2/3/4 – High Performance Differential MEMS Oscillators for Automotive Document Revision
Data Sheet – DSC12x2/3/4 Data Sheet
Data Sheet – DSC12x2/3/4 Data Sheet
Data Sheet – EMC1812/EMC1813/EMC1814/EMC1815/EMC1833 Data Sheet Data Sheet Document Revision
Data Sheet – High-Speed CAN Transceiver with Standby Modefor the Japanese Market
Data Sheet – HV256 32-Channel High-Voltage Amplifier Array Data Sheet Document Revision
Data Sheet – HV56264 Data Sheet Document Revision
Data Sheet – IS1870/71 Data Sheet
Data Sheet – KSZ8081RNA/RND – 10Base-T/100Base-TX PHY with RMII Support
Data Sheet – KSZ8794CNX – Integrated 4-Port 10/100 Managed Ethernet Switch
Data Sheet – KSZ8795CLX Integrated 5-Port 10/100 Managed Ethernet Switch with Gigabit GMII/RG Data Sheet Document Revision
Data Sheet – KSZ8895MQX/RQX/FQX/ML – Integrated 5-Port 10/100 Managed Switch
Data Sheet – LAN7430/LAN7431 Lower Power PCIe to Gigabit Ethernet Controller with Integrated
Data Sheet – MAQ5300 – Automotive Qualified Single Output 300mA MicroCap LDO Document Revision
Data Sheet – MCP1501 Data Sheet Document Revision
Data Sheet – MCP16301/MCP16301H Data Sheet
Data Sheet – MCP16331 Data Sheet Document Revision
Data Sheet – MCP16501 Cost and Size Optimized PMIC for SAMA5DX/SAM9X6/SAMA7G Series MPUs Data Sheet Data Sheet Document Revision
Data Sheet – MCP16502 – High-Performance PMIC for SAMA5DX/SAM9X6/SAMA7G MPUs Data Sheet Data Sheet Document Revision
Data Sheet – MCP1700 Low Quiescent Current Data Sheet
Data Sheet – MCP1754 150 mA, 16V, High Performance LDO Datasheet Document Revision
Data Sheet – MCP1755/1755S 300 mA, 16V, High-Performance LDO Data Sheet Document Revision
Data Sheet – MCP1811A/11B/12A/12B Family Data Sheet
Data Sheet – MCP19114/MCP19115 Data Sheet
Data Sheet – MCP2518FD Data Sheet
Data Sheet – MCP6C02 Data Sheet
Data Sheet – MGC3140 3D Tracking and Gesture Controller Data Sheet
Data Sheet – MIC20XX Family – Fixed and Adjustable Current Limiting Power Distribution Switches
Data Sheet – MIC20XX Family – Fixed and Adjustable Current Limiting Power Distribution Switches Datasheet Document Revision
Data Sheet – MIC2178 – 2.5A Synchronous Buck Regulator Document Revision
Data Sheet – MIC2179 – 1.5A Synchronous Buck Regulator Document Revision
Data Sheet – MIC2204 – High-Efficiency 2MHz Synchronous Buck Converter Document Revision
Data Sheet – MIC2206 – 2MHz PWM Synchronous Buck Regulator with LOWQ Mode and Voltage Scaling
Data Sheet – MIC2207 – 2 MHz 3A PWM Buck Regulator
Data Sheet – MIC2251 – High-Efficiency Low EMI Boost Regulator
Data Sheet – MIC23030 – 8 MHz PWM 400 mA Buck Regulator with HyperLight Load®
Data Sheet – MIC23051 – 4 MHz PWM Buck Regulator with HyperLight Load®and Voltage Scaling
Data Sheet – MIC23153 – 4MHz PWM 2A Buck Regulator with HyperLight Load® and Power Good
Data Sheet – MIC23450 – 3 MHz, PWM, 2A Triple Buck Regulator with HyperLight Load and Power Good
Data Sheet – MIC281 – Low-Cost Thermal Sensor Datasheet Document Revision
Data Sheet – MIC284 – Two-Zone Thermal Supervisor Datasheet Document Revision
Data Sheet – MIC28515 75V/5A Hyper Speed Control® Synchronous DC/DC Buck Regulator with Exter
Data Sheet – MIC28516 – 70V/8A Hyper Speed Control Synchronous DC/DC Buck Regulator with External Soft Start Datasheet Document Revision
Data Sheet – MIC28517 – 70V/8A Hyper Speed Control Synchronous DC/DC Buck Regulator with External Mode Control Datasheet Document Revision
Data Sheet – MIC33M350 Data Sheet
Data Sheet – MIC37150/51/52/53 Data Sheet
Data Sheet – MIC384 – Three-Zone Thermal Supervisor Datasheet Document Revision
Data Sheet – MIC4421A/4422A Data Sheet Document Revision
Data Sheet – MIC4574 Data Sheet
Data Sheet – MIC4575 Data Sheet
Data Sheet – MIC5353 – 500mA LDO in 1.6mm x 1.6mm Package
Data Sheet – MIC6315 Data Sheet Document Revision
Data Sheet – MRF24J40 Data Sheet Document Revision
Data Sheet – MX77 – Ultra-Low Jitter Clock Oscillator with Integrated Quartz Crystal
Data Sheet – MX87 Master Data Sheet
Data Sheet – PD70101/PD70201 Datasheet Document Revision
Data Sheet – PIC16(L)F18325/18345 Full-Featured, Low Pin Count MCUs with XLP Data Sheet Document Revision
Data Sheet – PIC16(L)F18856/76 Data Sheet
Data Sheet – PIC16(L)F18857/77 Data Sheet Document Revision
Data Sheet – PIC16F15256/74/75/76 28/40-Pin Microcontrollers Data Sheet
Data Sheet – PIC18(L)F26/27/45/46/47/55/56/57K42 Data Sheet Document Revision
Data Sheet – PIC18F24/25Q10 28-Pin, Low-Power, High-Performance Microcontrollers
Data Sheet – PIC18F25/45/55Q43 Data Sheet
Data Sheet – PIC18F26/45/46Q10 28/40-Pin, Low-Power, High-Performance Microcontrollers
Data Sheet – PIC18F26/46/56Q43 Data Sheet
Data Sheet – PIC18F27/47Q10 Data Sheet
Data Sheet – PIC32MK GENERAL PURPOSE AND MOTOR CONTROL (GPG/MCJ) WITH CAN FD FAMILY Document Revision
Data Sheet – PIC32MK GENERAL PURPOSE AND MOTOR CONTROL (GPK/MCM) WITH CAN FD FAMILY
Data Sheet – PIC32MZ1025W104 MCU and WFI32E01 Module with Wi-Fi® and Hardware-based Security Accelerator Data Sheet
Data Sheet – RE46C181 – CMOS Programmable Ionization Smoke Detector ASIC with Interconnect, Timer Mode and Alarm Memory
Data Sheet – RE46C191 Data Sheet
Data Sheet – RE46C201 – 9V Programmable Photoelectric Smoke Detector ASIC
Data Sheet – RN42/RN42N Class 2 Bluetooth Module with EDR Support Data Sheet
Data Sheet – RN4678 Bluetooth Dual-Mode Module Data Sheet
Data Sheet – RN4870/71 Bluetooth Low Energy Module Data Sheet
Data Sheet – SAM C20/C21 Family Data Sheet
Data Sheet – SAM D20 Datasheet
Data Sheet – SAM D5X/E5X Family Datasheet Document Revision
Data Sheet – SAM E70/S70/V70/V71 Family Data Sheet
Data Sheet – SAM3X8ERT Radiation-Tolerant 32-bit Arm® Cortex®-M3 Microcontroller
Data Sheet – SAMA5D2 MPU SiP with up to 1Gbit DDR2 or 2Gbit LPDDR2 Datasheet Document Revision
Data Sheet – SAMA5D2 Series Datasheet Document Revision
Data Sheet – SAMA5D3 Series Data Sheet Document Revision
Data Sheet – SAMRH71 Data Sheet
Data Sheet – SEC1110/SEC1210 – Smart Card Bridge to USB and UART Interfaces Data Sheet Document Revision
Data Sheet – SM806xxx Data Sheet
Data Sheet – SparX-5 Family L2/L3 Enterprise 10G Ethernet Switches Datasheet
Data Sheet – SparX-5i Family of L2/L3 Industrial 10G Ethernet Switches Datasheet
Data Sheet – SST26VF020A 2.5V/3.0V 2-Mbit Serial Quad I/O Flash Memory
Data Sheet – SY100EL34/L – 5V/3.3V 2, 4, 8 Clock Generation Chip Document Revision
Data Sheet – UCS2112 Data Sheet
Data Sheet – WLR089U0 Low Power LoRa® Sub-GHz Module Data Sheet Data Sheet Document Revision
Data Sheet – ZL40268 – Low Skew, Low Additive Jitter 8 Output HCSL/LVDS/LVPECL Fanout Buffer with Per Enable Control
Data Sheet Change for TCS3430
datasheet changes of W3H64M64E-xxxx
Datasheet Correction for MSL Rating
Datasheet error change
Datasheet Update for AT90PWM216 – AT90PWM316
DDR3 DRAM Suppliers and Die Revisions.
Delete Common AT Firmware on ESP32-C3 Series Modules from Manufacture Line
Deprecated WD_TIMEOUT Port to the Fabric
Design Change ZigBit 2.4GHz Amplified Modules
Die attach epoxy change for TQP7M9105
Die number revision
Die number revision
Die number revisions
Die number revisions
Die number revisions
Die number revisions
Die number revisions
Die Revision Change for ATxmega128A3U
Die Revision Change for ATxmega128D3
Die Revision Change for ATxmega128D3
Die Revision Change for ATxmega128D3
Die Revision Change for ATxmega16D4 / ATxmega32D4
Die Revision Change for ATxmega16D4 / ATxmega32D4
Die Revision Change for ATxmega16D4 / ATxmega32D4
Die Revision Change for ATxmega16D4 / ATxmega32D4
Die Revision Change for ATxmega192D3
Die Revision Change for ATxmega256D3
Die Revision Change for ATxmega64A3U
Die Revision Change for ATxmega64D3
Die Revision Change for ATxmega64D3
Die Revision Notification
Die revision notification.
Die Revison Change for ATxmega64A4U
DW3300Q Adding 2nd Sources
DW3310/DW3120 test platform/location addition
DWM1001-DEV and MDEK1001 BOM change
E Module Lead Frame Change notification
EDI88512CA(LPA)(15-25ns)-XMX and WPS512k8X-XRJX
Encapsulation Material Change
END OF LIFE (EOL) CCE4510 24QFN,
End of Life EVK1000
End-of-life and Replacement of MARC4 ICs by Metal Mask Versions
End-of-life and Replacement of MARC4 ICs by Metal Mask Versions
End-Of-Life for the U211B-MY
EOL AT25FS010 Product Family
EOL of AT83C26
EOL of PPM products
EOL of WEDC part numbers WPS128K32V-XPJX and EDI8L32128VXAX
Epoxy Change Notification
Epoxy Change Notification
Epoxy Manufacturing Location Change
Epoxy Manufacturing Location Change
Epoxy Manufacturing Location Change & MSL Update
Epoxy MFG Location Change
ERRATA – ATA6622C/24C/26C Errata and Data Sheet Clarifications
ERRATA – ATA6628/30 Errata and Data Sheet Clarifications Document Revision
ERRATA – ATA6663/64 Errata and Data Sheet Clarifications Document Revision
ERRATA – ATmega3208/3209 Silicon Errata and Data Sheet Clarification
ERRATA – ATmega4808/4809 Silicon Errata and Data Sheet Clarification
ERRATA – ATmega808/809/1608/1609 Silicon Errata and Data Sheet Clarification
ERRATA – ATtiny202/402 Silicon Errata and Data Sheet Clarification
ERRATA – ATtiny204/404 Silicon Errata and Data Sheet Clarification
Errata – ATtiny212/214/412/414/416 Silicon Errata and Data Sheet Clarification Document Revision
ERRATA – ATtiny3216/3217 Automotive Silicon Errata and Data Sheet Clarification Document Revision
ERRATA – ATtiny406 Silicon Errata and Data Sheet Clarification
Errata – ATtiny417/814/816/817 Silicon Errata and Data Sheet Clarification Document Revision
ERRATA – dsPIC33CH512MP508 Family Silicon Errata and Data Sheet Clarification
ERRATA – dsPIC33CK256MP508 Family Silicon Errata and Data Sheet Clarification
ERRATA – MEC170x Silicon Errata and Data Sheet Clarification
ERRATA – MEC172x Errata
ERRATA – PIC16(L)F15313/23 Family Silicon Errata and Data Sheet Clarification Errata Document Revision
ERRATA – PIC16(L)F15324/44 Family Silicon Errata and Data Sheet Clarification Errata Document Revision
ERRATA – PIC16(L)F15325/45 Family Silicon Errata and Data Sheet Clarification Errata Document Revision
ERRATA – PIC16(L)F15354/55 Family Silicon Errata and Data Sheet Clarification Errata Document Revision
ERRATA – PIC16(L)F15356/75/76/85/86 Family Silicon Errata and Data Sheet Clarification Errata Document Revision
ERRATA – PIC16(L)F18854 Family Silicon Errata and Data Sheet Clarification
ERRATA – PIC16(L)F18855/18875 Family Silicon Errata and Data Sheet Clarification Document Revision
ERRATA – PIC16(L)F18856/18876 Family Silicon Errata and Data Sheet Clarification
ERRATA – PIC16(L)F18857/18877 Family Silicon Errata and Data Sheet Clarification
ERRATA – PIC16(L)F19155/56/75/76/85/86 Family Silicon Errata and Data Sheet Clarification
ERRATA – PIC16(L)F19195/6/7 Family Silicon Errata and Data Sheet Clarification
ERRATA – PIC1615256/74/75/76 Silicon Errata and Data Sheet Clarifications
ERRATA – PIC16F15213/14/23/24/43/44 Silicon Errata and Data Sheet Clarifications Silicon Die Revision Addition
ERRATA – PIC18(L)F24/25K42 Silicon Errata and Data Sheet Clarification Document Revision
ERRATA – PIC18(L)F25/26K83 Family Silicon Errata and Data Sheet Clarification
ERRATA – PIC18(L)F26/45/46/55/56K42 Silicon Errata and Data Sheet Clarification Document Revision
ERRATA – PIC18(L)F27/47/57K42 Family Silicon Errata and Data Sheet Clarification Document Revision
ERRATA – PIC18F24/25Q10 Silicon Errata and Data Sheet Clarification
ERRATA – PIC18F24/25Q10 Silicon Errata and Data Sheet Clarification Document Revision
ERRATA – PIC18F26/45/46Q10 Family Silicon Errata and Data Sheet Clarifications
ERRATA – PIC18F27/47/57Q83 Silicon Errata and Data Sheet Clarification Document Revision
ERRATA – PIC18F27/47/57Q83 Silicon Errata and Data Sheet Clarification Silicon Die Revision Addition
ERRATA – PIC18F27/47/57Q84 Silicon Errata and Data Sheet Clarifications Document Revision
ERRATA – PIC18F27/47/57Q84 Silicon Errata and Data Sheet Clarifications Silicon Die Revision Addition
ERRATA – PIC18F27/47Q10 Family Silicon Errata and Data Sheet Clarifications
ERRATA – PIC24FJ256GA705 Family Silicon Errata and Data Sheet Clarification
ERRATA – PIC24FJ256GA705 Family Silicon Errata and Data Sheet Clarification
ERRATA – PIC24FJ64GP205/GU205 Family Silicon Errata and Data Sheet Clarification
ERRATA – PIC32CM MC00 Family Data Sheet Clarifications and Silicon Errata
ERRATA – PIC32MK Motor Control and General Purpose Errata and Data Sheet Clarification
ERRATA – PIC32MM0256GPM064 Family Silicon Errata and Data Sheet Clarification Document Revision
ERRATA – PIC32MZ-W1 MCU and WFI32E01 Module Errata
ERRATA – Rad-Hard 32-bit Arm® Cortex®-M7 Microcontroller for Aerospace Applications Errata Sheet
ERRATA – SAM C20/C21 Family Silicon Errata
ERRATA – SAM D09 Series Family Silicon Errata and Data Sheet Clarifications
ERRATA – SAM D10 Series Family Silicon Errata and Data Sheet Clarifications
ERRATA – SAM D11 Series Family Silicon Errata and Data Sheet Clarifications
ERRATA – SAM D20 Family Silicon Errata
ERRATA – SAM D5x/E5x Family Errata and Data Sheet Clarification
ERRATA – SAM E70/S70/V70/V71 Family Silicon Errata and Data Sheet Clarification
ERRATA – SAM L10/L11 Family Silicon Errata and Data Sheet Clarification
ERRATA – SAM L21 Family Silicon Errata and Data Sheet Clarification
ERRATA – SAM L22 Family Silicon Errata and Data Sheet Clarification Errata Document Revision
ERRATA – SAMA5D2 Family Silicon Errata and Data Sheet Clarification
ERRATA – SAMA5D2 System in Package (SiP) Silicon Errata and Data Sheet Clarifications
ERRATA – USB72x6/USB7252 Silicon Errata and Data Sheet Clarification Errata Document Revision
ESD Parameters Alignment to 3kV HBM 150V MM
ESP32 Efuse Bits Change
ESP32 IDF & AT Bin Upgrade
ESP32 Series Products Technical Document Change
ESP32-C3 Series products chip revision upgrade
ESP32-PICO-D4 Schematics Change
ESP32-WROVER-B Datasheet Amendments
ESP8266 modules AT bin upgrade to V1.7.3
ESP8266 Series Chip Product Technical Document Change
ESP8285 Datasheet Change
ESP8285 Flash Die Attach Film (DAF) Material Change
ESP8285 Series Chip Datasheet Amendments
Espressif Chip Product Cover Tape Material Change
Espressif common AT firmware is not flashed to ESP32 series of modules (8MB/16MB flash) by default from the manufacturing line
Espressif Common AT Firmware is not Flashed to ESP32-S2 & ESP8266 (16MB flash) Series of Modules by Default from the Manufacturing Line
Espressif Module MPN Upgrade
Espressif PCNs on module parts
Exchange of Pretreatment Chemistry to a cyanide free zincation and improvement of aluminum etch
Fab Change for AT86RF212B
Fab change for AT91R40008
Fab Change for AT91SAM7S256D and AT91SAM7S128D
Fabrication site of I2C CMOS controller die change
Filter Equipment Change for AS7000-AA
Filter Equipment Change for TSL2584TSV
Filter part marking change
Firmware Revision Change of AT42QT1110-MU/-AU
Flash and DAF Change for ESP8285N08 and ESP8285H08
Flash Part Number Change for ESP8266, EPS32, ESP32-S2 Modules Series
FMD PCN (FT531Ga)
For shipment in tape & reel, the tape material will be changed
FT24C02A-Kxx and FT24C04A-Kxx Serial EEPROM Family – Process Conversion
FT24CxxA-Exx Serial EEPROM Family – Process Conversion- Order Code Change
GaAs 4-inch to 6-inch Wafer Conversion
GaAs 4-inch to 6-inch Wafer Conversion
GaAs 4-inch to 6-inch Wafer Conversion
GaAs 4-inch to 6-inch Wafer Conversion
GD25Q128ESIG ESP32 16 MB flash Introduction of GD25Q128ESIG as alternative 16 MB flash source for ESP32 Series of Modules
Glass cover tape
GNSS Modules Update ORG1408, ORG1415, ORG1418
Gold Bond Wire Diameter Reduction for All 8 bit Microcontroller / AVR / Quantum Research & ASIC
Gold Bond Wire Diameter Reduction for All 8 bit Microcontroller / AVR / Quantum Research & ASIC
Gold Bond Wire Diameter Reduction for Industrial 8 bit Microcontroller (C51 and AVR) Products
Gold Wire Diameter Reduc. and Mold Compound Change, AT24, AT25, AT34, AT93
Gold Wire Diameter Reduction for Serial Flash, AT25, AT26, AT45
Gold Wire Diameter Reduction for Serial Flash, AT25, AT26, AT45
Greensboro production test transfer to Unisem
Greensboro production test transfer to Unisem
HT1381 ECN
IDP MSL Reclassification
Implement additional cover tape, carrier tape and plastic reel material supplier for selected Micrel products available in 3L, 5L, 6L and 8L SOT23, 5L and 6L TSOP and 8L SOIC packages at STAR assembly site
Implement Catalog Part Number (CPN) Changes to Atmel products
Implement MMT shipping tube for selected AT27xxxx, AT28xxxx and SST39xxxx products available in 32L PLCC package
Implement top marking changes for selected DSCxxx and DSAxxx products available in 6L VDFN, 4L VDFN, 4L VFLGA, 6L VFLGA, 4L VLGA, 14L VQFN and 20L VQFN packages at NSEB assembly site
Implementation of the BOD Feature in the ATA5771/73/74
IMU M-G370PDF0/M-G365PDx0 Design Change Information
Incorporation of ACP Philippines as Additional Probing Location into All PPAP Documents
Information Notification: Integration of the Microsemi FPGA, HRDS and MSA PCN system with the Microchip PCN System for selected Microsemi FPGA, HRDS and MSA products.
Inked wafer mark to Inkless wafers for Serial EEPROM AT24C/93C
Inkless Wafers for CryptoMemories and CryptoRF Device, AT88SC
INOVA Semiconductors INAP5x2-5TAQ: change to a FPGA Loadboard concept AND release of ASE-CL as a second test location
Introduce Alternate Cover Tape Supplier C-PAK
Introduce XM25QE32CHIGT08H as alternative 4 MB flash source to Espressif ESP32 Series Products
Introducing ASE as a new ATM plant for ESP8266EX
Introducing environmentally friendly trays for bulk packed silver-oxide batteries > 7.9mm diameter and the CR1025.IB
Introducing TH25Q-16HB-MSCI as an Alternative 16 Mb Flash for ESP8266 Module Series
Introduction New Embedded Flash Material on ESP32-C3FH4, ESP8685H4 and Related Module Products
INTRODUCTION OF A NEW 1.7V 2K SERIAL EEPROM; AT24C02B
Introduction of Flash Part Number XM25QH128CHIQT08Q as Main Source for ESP32 Series Modules
Introduction of FM25Q128A-SOB-T-G as Alternative 16 MB Flash Source to Espressif ESP32 Series Module Product
Introduction of GD25Q32ETIG as alternative 4MB flash source for ESP8266 Series of Modules
Introduction of GD25Q64ESIG as Alternative 8 MB Flash Source for ESP32-S3 Series of Modules
Introduction of GD25Q64ESIG as an alternative 8 MB flash source of Espressif ESP32 Modules
Introduction of new ATECC608B Trust device Family available in 8L UDFN and 8L SOIC packages as replacement to an existing ATECC608A Trust device family that are currently available in 8L UDFN and 8L SOIC packages
Introduction of New Three-Wire 2K-bit and 4K-bit Industrial Temperature Grade (-40°C to +85°C)
Introduction of New Two-Wire 4K-bit and 8K-bit Industrial Temperature Grade (-40°C to +85°C)
Introduction of New Two-Wire 4K-bit and 8K-bit Industrial Temperature Grade (-40°C to +85°C)
Introduction of UMC Fab 8 as 2nd Source Wafer Supply for New Generation RF Products
Introduction of UMC Fab 8 as 2nd Source Wafer Supply for New Generation RF Products
Introduction of ZB25VQ32BTIG as alternative 4 MB flash source for ESP8266 Series of Modules
Introduction XM25QH64CKIQB08S as Second Source Flash on ESP32-PICO-V3-02
KCC Certification ID and Identification Changes for ESP32-WROOM-32/32D/32U, ESP32-WROVERB/IB, ESP32-SOLO-1, and ESP-WROOM-02/02U Modules
KYEC – Use of Low Halogen Content HIC (Humidity Indicator Card)
KYEC testing site change from Chu-Nan factory to Tong-Luo factory
label change on reels, tubes, trays
Label changes on Espressif modules
LCP Lid tooling change
LE9551 Data Sheet Document Revision
Lead-frame, Mold compound material, Chip thickness
Leadframe change
Libero 12.2 Timing and P&R Changes
Libero Design Suite Software—Discontinuation of Support for Linux RHEL 6.6 Through RHEL 6.11 and CentOS 6.6 Through CentOS 6.11 Operating Systems
Libero SoC Timing Change and IO Glitch Notification
Libero SoC v12.4 Updates for PolarFire, SmartFusion2, and IGLOO2
Lid Material Change
Lid Material Change
Lok reel change
LTO LV Capacitor Breakdown Fix, AT88RF319
MAJOR — Punch (Singulation) MLF Assembly Site Transfer
Manufacturing Capacity Expansion for the 8-contact, 6 x 8mm, Very Thin Dual Flat No Lead Package (VDFN)
Marking Change for All mSilica Legacy Products
Marking Change Notification
Maximum Read Frequency on Certain LSRAM Read Modes Has Been Reduced
MCGA Daisy Chains Change
MCU Test, AT89, ATMEGA12, ATMEGA16, ATMEGA32, ATMEGA64, ATMEGA85, ATXMEGA12, ATXMEGA16, ATXMEGA3
MCU Test, AT89, ATMEGA12, ATMEGA16, ATMEGA32, ATMEGA64, ATMEGA85, ATXMEGA12, ATXMEGA16, ATXMEGA3
Memo # ML0220210045 Final Notice: Qualification of ANAC as an additional assembly site for USB4914T-I/Y9XVBA catalog part number (CPN) available in 48L VQFN (7x7x1.0 mm) package.
Memo Log # ML0220210001: Implementation of Catalog Part Numbers (CPN) convention changes for selected Microsemi High Reliability Discrete Solutions (HRDS) products including products with cage codes/manufacturer codes 43611/CDWR and SD633/CIRL.
Memo Log # ML122020009G Final Notice: Implement VDS(ON) specifications parameter change for RF MOSFET (VDMOS) VRF141, VRF141G and VRF141MP catalog part numbers (CPN).
Memolog # ML0220210049 Final Notice: Qualification of 66.88K process technology for selected Microchip products of the 24AA512, 24FC512 and 24LC512 device families.
Memolog # ML022021005B Final Notice: Implementation of catalog part number (CPN) convention changes to PM4xxxB Switchtec Gen 4 PCIe switches.
Memolog # ML022021005B Final Notice: Implementation of catalog part number (CPN) convention changes to PM4xxxB Switchtec Gen 4 PCIe switches.
MHz Range Crystal unit (for Automotive): Add manufacturing site notice
Microchip DPG PDM Non Hermetic Product Supply Chain Update
Microchip has released a new Product Documents for the dsPIC33CH128MP508 Family Silicon Errata and Datasheet Clarification of devices. If you are using one of these devices please read the document located at dsPIC33CH128MP508 Family Silicon Errata and Datasheet Clarification.
Microchip has released a new Product Documents for the MX77 – Ultra-Low Jitter Clock Oscillator with Integrated Quartz Crystal of devices.
Microcontroller Part Number Change, SL383 Replaced by Part Number Suffix
Microcontroller Part Number Change, SL383 Replaced by Part Number Suffix
Microsemi DPG PDM Non Hermetic Product Supply Chain Update
Migrating 3.3 V Simple PLDs -ATF22LV10C, ATF22LV10CZ, ATF22LV10CQZ Customers to RoHS
Migrating 3.3 V Simple PLDs – ATF16LV8C Customers to RoHS Compliant Fully Green Packages
Migrating all CPLDs [ATF15xx and ATF2500C] to ROHS Compliant Fully Green Simple PLD Package
Migrating AT17LVxxx and AT17Nxxx to ROHS Compliant Fully Green Configurator Package
Migrating ATF750C, ATF750CL and ATF750LVC to RoHS-Compliant
Migration of Solder Paste for Package Decoupling Capacitors from RoHS to Sn/Pb for PolarFire Military Temperature Devices
Migration to AT91SAM9G45 Revision B
Migration to AT91SAM9G45Revision B
Migration to Marketing Revision Level D of the AT91SAM7S256 & AT91SAM7S128
Migration to MarketingRevision Level B of the AT91SAM7SE32
Migration toAT91SAM9M10 Revision B
MIL-PRF- 38535 EOL notice for Samsung K6R4008C1D die; 5962-95600xxx, 5962-96795xxx
Minor Change – customer information
Minor updates to the CCS811 datasheet
Modifications to AT90PWM216 and AT90PWM316 Datasheet
Module Lead Frame Change Used for Smart Card Modules for the Secure Memory Family, AT88SC
Module Lead Frame Material Change for AT88SC102-09ET-00
Module Lead Frame Material Change Used for Smart Card Modules for the Crypto Memory, AT88SC
Moisture Sensitivity Level 1 for Automotive Devices in SO 8 Leads Package
Mold compound change notification
Mold compound change notification
MSC2X / APT2X Standard Part Number Changes
MSL rating reclassification for TGS2353-2-SM
MWE128K8-XCX Dynamic Supply Current Change
N32926 Product Change Notice
NanEye2D Supply Chain update
NanEye2D Supply Chain update
NEOTEC controller IC NT7108C EOL is replaced by NT7108T and NT7107C EOL is replaced by NT7107T2.
New and additional Test & Finishing line for ST25R3916 and ST25R3917
New Carrier Tape for 16 SOIC (0.300″ wide) Package, AT25DF, AT26DF
New CryptoMemory Wafer Stepping Pattern, AT88SC
New date code rule for all Zentel products.
New Final Test Location for SmartPower Devices
New Minimum Ordering Quantity (MOQ) Numbers for SmartPower Devices
New Ordering Code for AT90USBKEY Kit
New Sawing and Packaging Location of ATA556711N-DDT
New test platform (Diamond X) for PPM products
New Wafer Fab Location for the H-bridge Motor Driver IC ATA6823
New Wafer Sort Test Facility
New Wafer Sort Test Facility
New Wafer Sort Test Facility
New Wafer Sort Test Facility)
New Wrap Packaging for CATV Hybrid Products
New Wrap Packaging for CATV Hybrid Products
Notice of Our Supplier’s Improprieties regarding Certification of its Chemical Products, which Integrated into Epson’s Timing Device Products
Nuvoton PCN_N32926
Official cut-in of ESP32-WROOM-32 & ESP32-WROOM-32D
One layer mask Change for production test yield improvement; 16Mbit DataFlash Products AT45DB161E and AT45DQ161
One layer mask Change for production test yield improvemtn; 32Mbit DataFlash Products AT45DB321E and AT45DQ321
Package 400: 66 Pin, PGA Type, Ceramic Hex-in-Line Package, HIP (H1) Drawing Change
Package Testing for ATmega1284, ATmega16, ATmega162, ATmega164, ATmega32, ATmega324, ATmega644,
Package Testing for ATmega1284, ATmega16, ATmega162, ATmega164, ATmega32, ATmega324, ATmega644,
Package Testing for ATmega1284, ATmega16, ATmega162, ATmega164, ATmega32, ATmega324, ATmega644,
Packaging Changes to Espressif Modules
Packing Change for CQFP 256L Packages KA-KG-KZ
Packing Change for MCGA & LGA 25×25, 5962-0722401QXB
Packing Change for MCGA & LGA 29×29, 5962-01B010
Part number change
Part Number Change due to Package shrinks.
Part number changes
PCN FMD
PCN FMD
PCN FMD (FT531Ca)
PCN für MS3V Quarz
PCN of BL128128C2 series
PCN On ESP-WROOM-02 AT bin upgrade from version V2.0.0 to V2.1.
PCN on marking change of ESP8285, ESP32-D2WD, ESP32-PICO-D4 and ESP8-PICO-D2
PCN SMTM1632.TR
Piezo Driver MAS6240A1HP06, change in the specification
PolarFire FPGA HS_IO_PAUSE Issue
Power Supply Tolerances and Powering Transceivers
Pricing Changes on Mature Products
ProASIC3, IGLOO, Fusion, SmartFusion, ProASIC Plus, MX, and AX Family Devices–Change of Mold Compound and Die-Attach Epoxy
Process Change Notification for QPD1009
Product Change Notification (Glyn/Fujitsu)
Product Change Notification of addition of die source of various commercial devices
Product Change Notification of MX25L1025C
Product Labeling Change Notification
Product Marking Font change
Product Transfer to Atmel Colorado Springs Wafer Fabrication
Product Transfer to Next Generation Fab Process
Product Transfer to Next Generation Fab Process
Production site change notice Malaysia -> Japan
Production site will be changed from Iwate plant to Mie plant
Production site will be changed from Iwate plant to Mie plant
PSRAM size change in ESP32-WROVER series modules
PTN for the MB86H50/51
QM11044A enhanced Trigger Function
QM11133 Alternate Foundry Site
QM13013 End of Life
Qm13124C Branding Change
QM13124C, QM12114, and QM13341 add DZ assembly
QM23013 Datasheet Update and Fab Finalization
QM23341: Alternate Assembly Site
QM25032 – Add Costa Rica as Assembly Location
QM26001: Alternate Assembly Site and Processes
QM28006 Datasheet Correction
QM33120W test platform/location addition
QM45392 PA Design Change
QM58101Y Qorvo External Fab Polyimide Change
QM77048B/D/E Branding Change
QM77058D Filter Design Improvement
QM78210/QM78218 Controller Design Change
Qorvo Die Attach Epoxy Supplier Change
Qorvo Die Attach Epoxy Supplier Change
Qorvo Die Attach Epoxy Supplier Change
Qorvo Die Attach Epoxy Supplier Change
Qorvo SOT89 -MSL & ESD Notification
QPA0004, QPA0007 mold compound change
QPA2212D Die dimension change
QPA2212D Pad change, bonding change
QPA4586A Datasheet Update
QPA9122 die attach epoxy change notice
QPA9122 HBM ESD rating improvement
QPA9419 min Icq change
QPC1220Q Ext Fab Site and Laminate Supplier Change
QPC2040 mold compound change
QPC2108 mold compound change
QPD0305 Datasheet Correction
QPF5010 family, LNA die to 6-inch process
QPF5010, QPF5005, QPF5002 mold compound change
QPF5602Q 2nd Source (Silicon & Bump House)
QPG6095 ROM update and improved test efficiency
QPL1815 – Epi & Die Attach Epoxy Change
QPL1818 – MSL Update
QPL6220Q EPI Reactor Change
QPM1002 Specification Change
QPQ1214 Datasheet Correction
QPQ1270 wafer conversion & Mold compound change
QPQ1297 wafer conversion
QPQ6108 laminate change
QR CODE INFORMATION CHANGE FOR ESP32-WROVER-B MODULES
Quali. of Testing for ATmega1280, ATmega2560, ATmega3250, ATmega3290, ATmega640, ATmega6490, ATm
Qualification of an additional fabrication site for AT9933 Supertex device family.
Qualification of ANAC as an additional assembly site for selected LAN8710xx and LAN8720xx device families available in 32L VQFN (5x5x0.9mm) and 24L VQFN (4x4x0.9mm) packages
Qualification of ANAP as an assembly site for selected products available in 64L LQFP (10x10x1.4mm) package
Qualification of ANAP assembly site for selected products available in 64L LQFP (10x10x1.4mm) package.
Qualification of ASE assembly site as an additional site for selected products available in 24L QFN (5x5x0.9mm) package.
Qualification of ATP assembly site for AT88RF1354-ZU and AT88RF1354-ZU-T catalog part numbers (CPN) available in 36L VQFN package.
Qualification of ATP assembly site for AT97SC3204 device family available in40L MLF (or VQFN) package.
Qualification of DEI6 as a new assembly site for selected ATML ATSAMR21B18 and ATSAMR21G18 device families available in 9L and 48L Module package.
Qualification of EFTEC-64T lead-frame for selected products in 8L VDFN package at NSEB assembly site
Qualification of GTK assembly site for selected Supertex products using wafers with Au backside coating available in 3L TO-92 package
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the B2CD2 Process Technology.
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the B2M2 Process Technology
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCC Process Technology
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCD12 Process Technology
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCD2 Process Technology
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BCDM Process Technology.
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the BM2 Process Technology
Qualification of Microchip 8 inch Fabrication site for Micrel products manufactured with the CSI12 Process Technology
Qualification of Microchip Technology Tempe – Fab2 (TMGR) as an additional fabrication site for selected Atmel products
Qualification of MMT as a new assembly site for selected Atmel products available in 40L PDIP (600 mils) package
Qualification of MMT as an additional assembly site for selected MITCH112. MITCH180, PIC10xxxx and PIC12xxxx products available in 8L DFN (3x3x0.9mm and 2x3x0.9mm) package
Qualification of MMT as an additional Assembly site for selected products available in 16L (3x3x0.5mm), 16L (4x4x0.5mm), 20L (4x4x0.5mm) and 28L (4x4x0.5mm) packages
Qualification of MMT for Assembly and Final Test for all Military EEPROM Products available in Hermetic packages
Qualification of MTAI as an additional assembly site for selected Atmel products available in 8L SOIJ package.
Qualification of MTAI assembly site as an additional site for selected Supertex products available in 5L SOT-23 package
Qualification of MTAI assembly site as an additional site for selected Supertex products available in 8L MSOP package
Qualification of MTAI assembly site for selected products available in 64L QFN package with 311×311 and291x291 leadframe paddle size.
Qualification of MTAI assembly site for selected products available in 64L QFNpackagewith 311×311 and 291×291 leadframe paddle size
Qualification of non-conductive die attach epoxy 8900NC for selected products available in 8L SOIC package at MMT assembly site
Qualification of non-conductive die attach epoxy 8900NC for selected products available in 8L SOIC package at MTAI assembly site
Qualification of NSEB as an additional assembly site for selected products in 16L QFN package.
Qualification of palladium coated copper with gold Flash (CuPdAu) bond wire in selected products
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the 200K wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the 200K wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the0.25um TSMC wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected automotive products of the150K and 160K wafer technologies
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.18 and0.16um GF wafer technologies
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.25um TSMC wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 0.25um TSMC wafer technology
Qualification of palladium coated copper with Gold Flash bond wire in selected products of the 150K and 160K wafer technologies
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 200K Wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 200K Wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 40K Wafer technology
Qualification of palladium coated copper with gold Flash bond wire in selected products of the 90K and 120K wafer technologies
Qualification of palladium coated copper with Gold Flash bond wire in selected products of the150K and 160K wafer technologies
Qualification of palladium coated copper with Gold flashbond wire in selected products of the120K wafer technology
Qualification of Testing for ATmega1280, ATmega2560, ATmega3250, ATmega3290, ATmega640, ATmega64
Qualification of UMC Fab 8N as an additional fabrication site for various Atmel catalog part numbers
Qualify GDSI for ASIC Military Wafer Backgrind Operation; 8100, 8200, AT8356, AT8357
Reduction in package size and part number change.
Release and Introduction of AT Firmware V2.2.0.0 into ESP32-MINI-1 & ESP32-MINI-1U Modules
Release ESP32-C3-MINI-1 module Default Common AT firmware V2.4.2.0
Removal of the 868MHz Option and the Full-duplex Operation Mode
Remove Hall Sensor from ESP32 Series of Documentation
Replace AT88SA102S with ATSHA204
Replace Military with Extended temperature conditions
Replacement for Military AT28C010E Devices (Speed Grades 20ns and 25ns)
Replacement for Military AT28C256F Devices (Speed Grades 20ns and 25ns)
Replacement of TSPIC (Atmel Philippines) with ATEC (Philippines) for Specific Assembly Sawing pr
Replacement Products for theAT32UC3A0 and AT32UC3A1 Product Family
Restart production in XFab
Restore TGA4509 to production status
Revise PCB layout of BC2004A series.
Revise Reflow temperature in datasheet
Revision Change for AT42QT1481
Revision/correction to Product W3H32M64E-XSBX to W3H32M64EA-XSBX
RF1492Y IPD Supply Change
RF1498Y IPD Supply Change
RF1656 and RF1658 Additional Assembly Supplier
RF1657 Alternate Assembly Site
RF7907 Package Dimension Correction
RFCA8828 – Test Location Change
RFCA8830 – Die Probe Optimization
RFFM8595A Datasheet Update
RT ProASIC®3 Datasheet TID Radiation Performance Update
RTG4 Family Important Changes
RTG4 LSRAM Circuit for Pipelined ECC and I/O Driven High at the End of Programming
RTG4 PLL Lock Stability Customer Notification Second Addendum
RTG4 SET Filter Delay Calibration Update
RX-****LC, SG-30**LC and RX8010SJ production site change notice
SAM4E rev B
Second site for backend final testing
Second source for wafer fabrication AS3685
Second Wafer Fab Source for AT75k Technology (SMARTIS); ATA6662/6622/6624/6623/6625
Security Advisory for USB_OTG & USB_Serial_JTAG Download Functions of ESP32-S3 Series Products
Security Change in PolarFire FPGAs
SEEPROM EIAJ/SOIC 209 Mil Package Assembly a.Test, AT24, AT25, AT93
SEEPROM EIAJ/SOIC 209 Mil Package Assembly a.Test, AT24, AT25, AT93
SEEPROM EIAJ/SOIC 209 Mil Package Assembly a.Test, AT24, AT25, AT93
SEEPROM SOIC- 8L (150 Mil) Package Assembly & Test, AT24, AT34, AT93
Serial EEPROM Copper (Cu) Bond Wire Change for the AT24Cxxx; AT25xxx; AT93xxx
Serial EEPROM Cu Wire Bond Change on 8 Lead SOIC and TSSOP Packages
Serial Tag: change of Supplier for tags used on DO213AA and Current Regulator DO213AB
SG3225EEN/VEN/HBN and SG7050EEN/VEN IC pad structure change notice
Shield Cover Marking Change for ESP Modules
Shield Cover Marking Change for ESP32-C3-MINI-1 Modules
Shield Cover Marking Change for ESP32-S3 Series Modules
Shield Cover Marking Change for Espressif Modules
Silicon Diode die change on APTDF400xx170G standard products
Silicon revision change from A to B for ATSAMG55G19 device family.
SIM 7020 E ND changes PA
SIM 7020 G changes PA
SIM7000G/SIM7000E change 2G PA and IC
SIM7500E add alternative PAs
SIM7500E-L1C add alternative PAs
SIM7500SA add alternative PA
SIM7600E add alternative PAs
SIM7600E-H add alternative baseband chip & PAs
SIM7600E-H1C add alternative baseband chip & PAs
SIM7600E-H1CD add alternative baseband chip & PAs
SIM7600E-L1C add alternative PAs
SIM7600JC-H add alternative baseband chip & PAs
Smart Card Reader Products Package Marking Change, AT83C, AT83R
SmartPower Devices – Convert MSL3 to MSL1 for QFN Packages Manufactured at ASE Chung-Li, Taiwan
SOI Die Transfer to Alternate Supplier
Solder bump alloy change to all Power PC die
SOT-89 Manufacturing Robustness Improvement
SOT-89 MSL Update (HPA-BBD)
SOT89 manufacturing robustness improvement
SOT89 manufacturing robustness improvement
SOT89 MSL Update (HPA-BTS)
Spansion S29AL008D die revision change to S29AL008J die
SPI Flash and LDO Part Number Changes in SmartFusion2 and IGLOO2 Evaluation Kits
SPXO SG-210STF Product change notice
ST25R, NFC Reader IC family (ST25R3911B / ST25R3916) Pb-free category symbol marking change
ST25R3911B, NFC Reader IC backend update
Stacking adhesive change from DAF to Ag-Sintered
Std prod die changed from waffle pack to gel pack
Supplemental assembly source for QFP
T2525NxxxC VIA Layer Change & Transfer Wafer Fab Location
T2525NxxxH VIA Layer Change & Transfer Wafer Fab Location
T2526NxxxC VIA Layer Change & Transfer Wafer Fab Location
T2526NxxxH VIA Layer Change & Transfer Wafer Fab Location
T2G4005528-FS 4-in to 6-inch Wafer Conversion
T2G6003028-FL and -FS Die Change
T2G6003028-FL Second Source Package Introduction
T2G6003028-FS Second Source Package Introduction
T5750_T5753_T5754 Wafer FabTransfer to Atmel Colorado Springs
T6818 Assembly LocationChange to ASE Shanghai, China
tape & reel transfer to austriamicrosystems Philippines
Tape & Reel, Burn-in service for AS8202x will be transferred
Tape Size change for multiple parts
Tape Size change for multiple parts
TAT6254C – Marking Change
TAT7461 – Fab Process Change
TAT8804D1H – Epi Manufacturing Location Change
TCXO TG3225CEN Ceramic package change notice
Technology Shrink of Automotive Microcontrollers Product ATMega48/88/168 and ATMega164P/324P
Terminal plating (Sn-Bi to Pure-Sn) and Saw type of QFN
Test location and platform change
Test Location Change of AVR MCU Parts Tested at Atmel San Jose Facility to ASET (ASE-Kaoshiung-T
Test Location Change of AVR MCU Parts Tested at Atmel San Jose Facility to ASKR (ASE-Korea)
Test Location Move and Test Platform Transfer for ENS210-LQFM
Test Location Site change
Test Operation Location Change for Mil-Std-883, AT28C, AT28HC
Test Operation Location Change for Mil-Std-883, ATF750, AT22, ATF22
Test Site Addition
Test Site Addition – LPS Products – Notification
Test transfer to PH: AS1100, AS1105, AS1106, AS1107, AS1108, AS1111, AS1114
TestLocation Change of AVR MCU Parts Tested at Atmel San Jose Facility to ASKR(ASE-Korea)
TestLocation Change of AVR MCU Parts Tested at Atmel San Jose Facility to ASKR(ASE-Korea)
TGA2237-SM Package Enhancement
TGA2237-SM Package Enhancement
TGA2307 / TGA2307-SM die mask change
TGA2575/QPA2575, 4-inch to 6-inch wafer conversion
TGF2819-FS Change to 3MIG2
TGF2929-HM Change to 3MIG2 EG4355
TGF2979-SM Change to 3MIG2 EG4381
TGF3020-SM Change to 3MIG2
TGF3020-SM: Die attach material change
TGL2201-SM datasheet limit change
TGS2355-SM Lid Material Change
TH25Q-16HB-MSCK ESP8266 2MB flash Introduction of TH25Q-16HB-MSCK as an alternative 2 MB flash source for ESP8266 Series of Modules
The microcode has been changed to implement guided lock for the HDMI PLL.
The PCB EPAD Vias are Changed to be Double-sided Plugged for ESP32-WROVER-E/IE
To change the IC top marking company logo from Winbond to Nuvoton
Topside Laser Marking on Plastic Lead Chip Carrier Packages,AT17
TQP369185 Datasheet Typo Correction
TQP9108 Datasheet OIP3 spec change
Transfer Blister Packaging of Dies from Atmel Heilbronn to On-site Subcon at Atmel
Transfer Final Test, Finishing and Warehouse Storing of U3280M from Heilbronn, Germany to ACP/TS
Transfer of 6 and 7 mil Backgrind OperationsAT24/25/29/88; ATD88
Transfer of Assembly Location from CEI Thailand to ASE Shanghai, China
Transfer of Inside Secure Global Warehouse Operations to HK HUB
Transfer of Parallel EEPROM AT28 Products
Tray dimension change for plastic QFP-208 and QFP-256
Tray for Holder HU2032-LF
Tray for Holder HU2430-LF
Tray for Holder HU2450N-LF
Tray for Holder SMTU1225-LF
Tray for Holder SMTU1632-LF
Tray for Holder SMTU2032-LF
Tray for Holder SMTU2430-LF
Tray for Holder SMTU2450N-LF
Tray for Renata Holders packed in trays
UMC 8D Wafer Fabrication Facility for All AT45DB321E Products
Update data sheet of ACT88321/ACT88329
Update ESP32 ESP32 (4MB flash) series modules AT firmware version to V2.1.0.0
Update for ATA664151-WNQW
Update on Power Down Current in the VIF Pin (Pin 6)
Updated Digital die revision
Updating Operation Temperature Information and Changing C18 Capacitor of ESP32-WROVER
Updating package standoff, maximum package height and lead thickness on WF2M16-XDAX5, WMF2M8-XDAX5
Updating the Datasheets of the ESP32 Series of Products
Updating the PCB boards of ESP8266 & ESP32 series
Upgrade Chip Revision of ESP32 Series Products
Upgrade Chip Revision of ESP32-C6 Series Products
Upgrade Chip Revision of ESP32-S2 Series Products Based on ESP32-S2
Upgrade Chip Revision of ESP32-S2 Series Products Based on ESP32-S2R2 and ESP32-S2FN4R2
Upgrade Chip Revision of ESP32-S3 Series Products
Upgrade ESP32-C2 (ESP8684) Series from Chip Revision v1.0 to Chip Revision v1.1
Upgrade ESP32-C2 (ESP8684) Series from Chip Revision v1.1 to Chip Revision v1.2
Upgrade Manufacturer Part Number and Laser Marking of Espressif Module
Upgrade of ESP32 PICO Series Product
Upgrading AT Firmware for ESP32 Modules
UWBU Supply Chain Integration
VaultIC420 and VaultIC460 product release change
VOL test condition to 10mA on Flash modules
W3H128M64E, W3H128M72E, W3H128M72E > Die Revision
W3H128M72E-XSBX datasheet change
W3H32M64E, W3H32M64EA, W3H32M72E > Die Revision
W764M32V-XSBX, D50010 and D50031 die EOL notification
Wafer Fab transfer from Garden Grove to Microchip Fab 2
Wafer Fab Transfer to Atmel Colorado Spring for the ATA5724P3-TKQY 19
Wafer Fab Transfer to Atmel Colorado Springs for the ATA8401/2/3
Wafer Fab Transfer to AtmelColorado Spring for the ATA5721-PLQW and ATA5722-PLQW 19
Wafer fabrication transfer; AS2522B
Wafer fabrication transfer; AS253X; AS2533; AS2534; AS2535; AS2536
Wafer FabTransfer to Atmel Colorado Springs and EOL of the TSG Product Version
Wafer Foundry Transfer from LFoundry to Alternative Foundry Locations
Wafer Foundry Transfer from LFoundry to UMC
Wafer Foundry Transfer from LFoundry to UMC
Wafer Foundry Transfer, 58910(UMC) from 58901(LF) for 86RF231
Wafer Probe Test System and Location Change for Atmel GPS Basebands
Wafer Process Technology Change
Wafer Test Platform change for QPG5072/QPG6105
Waterfall Miura-B1 Final Notice: Implement silicon die revision B1 and implement additional chip ID for selected ATSAMA5D3xx device families.
WC32P040-XQ4M Mechanical Dimension Change
WC32P040-XXM, Changed Figure 13 – 184 Lead, Ceramic Quad Flat
WED3C755E8MCX-XBX(-XBHX) power consumption change.
WEDPZ512K72V-XBX datasheet update
WEDPZ512K72V-XBX die change notification
WS1M32-XH2X datasheet update
XM25QH64CHIQT08S 8 MB flash Introduction of XM25QH64CHIQT08S as an alternative 8 MB flash source of Espressif Modules
64-Mbit DataFlash® (AT45DB641E) Wafer Manufacturing Plant Addition
AC TIMING CHANGES FOR THE 1600Mbs 4GB DDR3 LP devices
Add 2nd Source Assembly Site
Add Alternative 16 MB Flash Source for ESP32-S3 Series of Modules
Add Alternative 4 MB Flash Source for ESP32 Series of Modules
Add Alternative 8 MB Flash Source for ESP32-S3 Series of Modules
Adding a new assembly vendor– OSE, located in Kaohsiung, Taiwan, for 63CSP (9x11x1.0 mm)
Adding Copper Bonding Wire Capability for Selected ARM Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Adding Copper Bonding Wire Capability for Selected Microcontrollers
Addition of a 15,000 Unit/Reel Ordering Option for the UDFN Package for all Serial
Addition of a SOT-89 Assembly CM
Addition of ASET as test facility for MEGA2564RFR2, MEGA1284RFR2,
Addition of Assembly & Test Site
Addition of Assembly and Test Site for QPA9442
Additional manufacturing location and die revision for selected ATmega48, ATmega88, ATmega168 and ATmega328 microcontrollers
Alternate Bump House
Assembly & Test Site Addition – QPC4270
Assembly & Test Site Change for AWS-0103, AWS-0101
Assembly Site Change for AWMF-0106
Assembly yield improvement
AT90SCR200_new Metal 3 reticule mask to improve Yield
AT91RM9200 Migration to UMC Foundry
AT91SAM9G45 and AT91SAM9M10 MRL C Marking
AT91SAM9G45 Migration to Revision C
ATMEGA128RFA1 Rev D to F
ATMXT1066T2 Firmware Revision Change from v1.2.AA to v1.3.AA
ATMXT1066T2 Firmware Revision Change from v1.3.AA to v1.4.AA
ATMXT112S Firmware Revision Change from v2.0.AA to v3.0.AA
ATMXT336S / ATMXT224S FIRMWARE REVISION CHANGE FROM v3.0.AB TO
ATMXT336T & ATMXT224T FIRMWARE REVISION CHANGE FROM V3.0.AB TO V3.1.AA
ATMXT640T FIRMWARE UPDATE FROM v1.5.AA TO v1.6.AA
Automotive Second Source Bump House
AWMF-0106 Test Location Change
AWMF-0146/AWMF-0147 Test Location Change
Bolymin [ECR] Revise the FPC to grid type for BL12896A series
Capacity Expansion for the UDFN product package
CCB 3192.008 Final Notice: Qualification of MMT as a new final test site for Micrel SY88063CLMG and SY88063CLMG-TR catalog part numbers (CPN) available in 16L VQFN (3x3x1.00mm) package.
CCB 4440 Final Notice: Qualification of MMT as an additional assembly site for selected MTCH112, MTCH810 and PIC12xxxx device families available in 8L DFN (3x3x0.9mm) package.
Change in Package Marking for Selected AVR XMEGA D4/D3/A4U Microcontrollers
Change of Assembly Location ATA664151
Change of Assembly Location ATA664251
Change of Assembly Location Automotive Products
Change of Assembly Location Automotive Products
Change of Assembly Location Automotive Products
Change of Assembly Location Automotive Products
CMD192 datasheet update
CMD319C3 datasheet updates
Datasheet Correction
DC/DC component change for DWM1000
Design change and test facility change for AT86RF215 and AT86RF215IQ
Design Change and Test Facility Change for AT86RF215M
EOL Notification for QPA4501
Espressif PCN20240602 Upgrade ESP32-S2 Series Products Based on ESP32-S2FH4
Fab and Assembly Location Change for ATmegaXXXRFR2
Fab site change for AWMF-0146 and AWMF-0147
IM Brand DRAM Module Labels Change
Installation of improved fab metallization process for 0.35 μm technologies
Introduction of SAM9XE Marketing Revision (MRL) B
Leadframe Manufacturer Change (Broad Band)
Leadframe Manufacturer Change – RFSA3043
Leadframe Manufacturer Change for TQP9113
Leadframe Manufacturer Change
Leadframe Manufacturer Change
Leadframe Manufacturer Change
Lid Attach Epoxy Change
M90E32AS PCN
MAJOR — Punch (Singulation) MLF Assembly Site Transfer
Migration of ATSAM3S1 from Revision A to Revision B
MSL Update – TGA2803-SM
MSL Update: TGA2533-SM, TGA2535-SM & TQP4M9071
MXT1664T3 Firmware v1.1 Release
New Die revision of Atmel|SMART Connect Wi-Fi Product Line
New Errata in SAM D20 Revisions D and E and Update to NVM User Row Mapping
New Source Bump House
New wafer fabrication facility and die revision for ATmega48PB, ATmega88PB and ATmega168PB
Package Changes
PCI for SCR200 products
PCN INAP375T
Pervasive PCN E2271CS023
Product-Change-Notification of BMA222E
Product-Change-Notification of BMA250E
Production change due to our factory transition (New Dicing Factory and Shipping location)
Production change due to our factory transition (New Packaging Factory, Test and Shipping location)
QM12102 Laminate Supplier Change
QM35725 – End of Life
QM42391TR13 alternate fab
Qorvo 2nd Source EPI Supplier in Richardson Fab
Qorvo Laminate Supplier Change
Qorvo New EPI Supplier in Oregon Wafer Fab
Qorvo New EPI Supplier in Oregon Wafer Fab
Qorvo New EPI Supplier in Oregon Wafer Fab
Qorvo New EPI Supplier in Oregon Wafer Fab
Qorvo New EPI Supplier in Oregon Wafer Fab
QPA1724 ESD CDM Rating Update
QPA1724 Package Changes
QPB1029 Package Height Change
QPF4211 Assembly Site Change
QPF7900Q Second Source Bump House
QPM1021 Thin Film Network (TFN) change
Qualification of JCAP as Additional Source of WLCSP Assembly and Test
Qualification of top marking, assembly and final test site at MTAI as an additional site for selected AT24Cxx device family available in 5L SOT-23 package.
Qualify New EPI Supplier for Qorvo’s fab process
Qualify new leadframe
Qualify new molding compound
Qualify PFAS-free PBO and new exposure equipment
Relayout the FPC of BL160128A series
Revision of POR (Power On Reset) Circuit of AT25xxxB Automotive grade Serial EEPROMs
Revision of POR (Power On Reset) Circuit of AT25xxxB Automotive grade Serial EEPROMs
SAM G51 comes with Factory Programmed Bootloader
SAM7X256/128 Rev C – Wafer Foundry Transfer from LFoundry to UMC
SAM7XC512 manufacturing transferred to UMC 8C.
Second source for wafer fabrication
Serial EEPROM Copper (Cu) Bond Wire Change
SIM7906G-M2 (S2-10CGZ) RF component change
SIM7912G-M2 (S2-10CGY) RF component change
Site Changes
Site Change
Substrate Material Change of BGA Products
Substrate Supplier Change (Subtron)
Substrate Supplier Change
Substrate Supplier Change
Sumitomo compound EME-G700 change for LINGSEN TSOP48
Tape and Reel Labeling Process Change
Termination of creating new masks for MCU
Test Location Move and Test Platform Transfer for TSL25715FN, TSL25721FN, TCS37715FN, TCS37717FN, TCS34725FN
Test Site Addition
TGF2965-SM Marking Change
To revise PCB of BC2004A series
Transition from Non BSP to BSP For DF-8805
UMC 8D Wafer Fabrication Facility for All AT45DB321E Products
Update Integrated Flash of ESP32-C3FH4 Series Products
Update of the Datasheets regarding pureRXMode
Update of the Datasheets regarding pureRXMode
Upgrade In-package Flash of ESP32-S3FH4R2 Series Products
Upgrade of ESP32-C2 (ESP8684) Series Products
Upgrade of ESP32-C6 Series Products
Upgrade of ESP32-H2 Series Products
WC142802-Cu-Wire-PCN-for-Selected-MCU.pdf
WLCSP Product Transfer from Flipchip International to DECA Technologies
Xsense Shipment : Full Line Conversion from 6” ABS Cushion to 6” Hard Cores
 Leadframe Manufacturer Change
(EN) EOL of Fujitsu