The SIM8202G-M2 is the Multi-Band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module which supports R15 5G NSA/SA up to 2.4Gbps data transfer.
It has strong extension capability with abundant interfaces including PCIe, USB3.1, GPIO etc. The module provides much flexibility and ease of integration for customer’s applications.
The SIM8202G-M2 adopts M.2 form factor, TYPE 3042-S3-B. AT commands of SIM8202G-M2 are compatible with SIM7912G/SIM8200X-M2 series modules. This also minimizes the investments of customers and enables a short time-to-market.
It is designed for applications that need high throughput data communication in a variety of radio propagation conditions. Due to the unique combination of performance, security and flexibility, this module is ideally suited for many applications.
Product Key Features
Compared with other 5G modules, it is greatly improved in the following aspects
1. New 4-antenna design
SIM8202G-M2 adopts a new 4-antenna design, which effectively increases communication capacity, sends and receives data in an active manner, and maintains high data speed and stability.
2. Ultra-small size
The size of SIM8202G-M2 is only 30*42mm. The reduction in size brings great challenges to technology and process design. The increase in internal components leads to a denser component layout, causing limited power line routing width, harder isolation and protection of the high-rate signal line, RF-sensitive line, clock signal and harder controlled impedance routing. Therefore, SIMCom repeatedly optimized the design and deleted redundant design. Components with smaller package dimensions, higher performance and more reliable quality are adopted to effectively meet the multi-band/high-performance/high-bandwidth/multi-system requirements of 5G modules.
3. Large exposed copper area facilitates heat dissipation
The transmission rate of 5G modules is greatly increased. The increases in power consumption by CPU, RF transceiver and RF PA all generate more heat in modules. To ensure the module can work stably for a long time, the design of SIM8202G-M2 takes full account of the layout of heating components, making sure the main heating components have sufficient holes to base. At the same time, a large exposed copper area is designed on the back of the module to facilitate the heat dissipation of the module by silica gel.
SIM8202G-M2 features high-speed transmission and low latency. It can be widely used in terminals for VR, AR, CPE, IoV, IIoT and 4K /8K HD video.